CUI Devices BGA Heat Sinks are ideal for ball grid array (BGA) devices and are measured under four conditions for thermal resistance. These heat sinks carry power dissipation ratings from 1.92W up to 15.83W at +75°C. Made from aluminum with a black anodized finish, the HSB series supports a wide range of sizes, from 8.5mm x 8.5mm to 60mm x 60mm, with profiles from 6mm to 25mm. As adhesive mountable devices, CUI Devices BGA Heat Sinks are essentially simple extrusions where the extruded fins have been crosscut into pins, making them suitable for BGA applications.
Aluminum with a black anodized finish
1.92W to 15.83W power dissipation ratings at +75°C
Measured under four conditions for thermal resistance