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FS820R08A6P2BPSA1

Name: Infineon FS820R08A6P2BPSA1
Brand: Infineon Technologies
SKU: 726-FS820R08A6P2BPS1
Price: 37252.82 PHP
Availability: Discontinued

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Mouser #:

726-FS820R08A6P2BPS1

Mfr. #:

FS820R08A6P2BPSA1

Mfr.:

Infineon Technologies

Paglalarawan:

IGBT Modules HYBRID PACK DRIVE

Lifecycle:

NRND:

Hindi inirerekomenda para sa mga bagong disenyo.

Datasheet:

FS820R08A6P2BPSA1 Datasheet (PDF)

ECAD Model:

I-download ang libreng Library Loader para i-convert ang file na ito para sa iyong ECAD Tool. Matuto nang higit pa tungkol sa ECAD Model.

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Availability

Stock:: Hindi Naka-stock

May nangyaring di-inaasahang error. Subukan ulit mamaya.
Lead-Time ng Pabrika:: Humiling ng Quote sa Paghahatid

Matagal na lead time na iniulat sa produktong ito.

Ipasok ang Dami:

Minimum: 6 Mga Multiple: 6

Presyo ng Unit:

₱-.--

Ext. Presyo:

₱-.--

Est. Taripa:

LIBRENG Ipapadala ang Produktong Ito

Presyo (PHP)

Dami	Presyo ng Unit	Ext. Presyo
	₱37,252.82	₱223,516.92
	₱33,166.72	₱398,000.64

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Katangian ng Produkto	Value ng Attribute	Pumili ng Attribute
Manufacturer:	Infineon
Kategorya ng Produkto:	Mga IGBT Module
RoHS:
Produkto:	Hybrid IGBT Modules
Kumpigurasyon:	6-Pack
Collector- Emitter Voltage VCEO Max:	750 V
Collector-Emitter Saturation Voltage:	1.1 V
Tuloy-tuloy na Collector Current sa 25 C:	450 A
Gate-Emitter Leakage Current:	400 nA
Pd - Power Dissipation:	714 W
Package / Case:	Module
Minimum na Operating Temperature:	- 40 C
Maximum na Operating Temperature:	+ 150 C
Packaging:	Tray
Brand:	Infineon Technologies
Maximum na Gate Emitter Voltage:	20 V
Isitilo ng Mounting:	Screw Mount
Uri ng Produkto:	IGBT Modules
Series:	IGBT EDT2
Dami ng Pack ng Pabrika:	6
Subcategory:	IGBTs
Teknolohiya:	Si
Pangalang pangkalakal:	HybridPACK PressFIT
Mga Alias ng # ng Piyesa :	FS820R08A6P2 SP001499702
Timbang ng Unit:	720 g

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Mga Piniling Attribute: 0

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CNHTS:: 8504409100
CAHTS:: 8541290000
USHTS:: 8541290065
JPHTS:: 8541290100
KRHTS:: 8541299000
TARIC:: 8541290000
MXHTS:: 85412999
ECCN:: EAR99

Automotive HybridPACK™ IGBT Modules

Infineon Technologies Automotive HybridPACK™ IGBT Modules extend across the full power spectrum required in electric and hybrid electric vehicles (EVs/HEVs). These compact modules are available in six RoHS-compliant versions with three base plate options: copper, direct cooled with ribbon bonds, and direct cooled with pin fins. The modules offer an integrated NTC temperature sensor, PressFIT contact technology, and guiding elements for easy PCB and cooler assembly. Other features include high creepage and clearance distances, high power density, and low switching losses. Applications for Infineon Automotive HybridPACK IGBT Modules include EVs, HEVs, motor drives, and commercial agriculture vehicles.

750V HybridPACK™ Drive Modules

Infineon Technologies 750V HybridPACK™ Drive Modules are compact power modules optimized for hybrid and electric vehicle main inverter applications (xEV). The HybridPACK modules come with mechanical guiding elements, supporting easy assembly processes. The press-fit pins for the signal terminals avoid time-consuming selective solder processes, which provide cost savings on a system level and increase system reliability.