ATS-1041-C1-R0

Advanced Thermal Solutions
984-ATS-1041-C1-R0
ATS-1041-C1-R0

Mfr.:

Paglalarawan:
Heat Sinks maxiFLOW BGA Heat Sink+Plastic pushPIN, High Performance, Cross-Cut, 41x45x10mm

Datasheet:
ECAD Model:
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Alamin pa ang tungkol sa Advanced Thermal Solutions ATS-1041-C1-R0

May Stock: 29

Stock:
29 Maaaring Ipadala Agad
Lead-Time ng Pabrika:
8 (na) Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.
Ang mga dami na higit pa sa 29 ay sasailalim sa minimum na mga kinakailangan sa pag-order.
Minimum: 1   Mga Multiple: 1
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱1,078.80 ₱1,078.80
₱1,016.16 ₱10,161.60
₱956.42 ₱19,128.40
₱896.68 ₱44,834.00
₱844.48 ₱84,448.00
₱803.88 ₱160,776.00
₱774.88 ₱387,440.00

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Advanced Thermal Solutions
Kategorya ng Produkto: Mga Heat Sink
RoHS:  
Heat Sinks
BGA
Bracket
Aluminum
Cross Cut Fin
5 C/W
41 mm
45 mm
10 mm
Brand: Advanced Thermal Solutions
Kulay: Green
Bansa ng Pag-assemble: Not Available
Bansa ng Diffusion: Not Available
Bansang Pinagmulan: CN
Packaging: Bulk
Uri ng Produkto: Heat Sinks
Series: maxiFLOW XCut PushPIN
Dami ng Pack ng Pabrika: 100
Subcategory: Heat Sinks
Pangalang pangkalakal: maxiFLOW pushPIN
Uri: Component
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Mga Piniling Attribute: 0

Datasheet

Test/Quality Data

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CNHTS:
7616991090
CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

maxiFLOW™ Cross-Cut Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Cross-Cut Heat Sinks feature a spread-fin array to maximize surface-area cooling and deliver excellent thermal performance. Effective convection cooling from the spread-fin arrays enables a 20% lower junction temperature and a 40% reduction in thermal resistance compared to straight-fin and pin-fin sinks. Whenever higher cooling capacity is required, maxiFLOW heat sinks with thermal tape can be used, and the double-sided adhesive thermal tape enables the attachment of the heat sink to the device. Advanced Thermal Solutions maxiFLOW Cross-Cut Heat Sinks meet the thermal requirements of various electronics packages, including BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, and LQFP.

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