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ATS012012011-SF-2J

Name: Advanced Thermal Solutions ATS012012011-SF-2J
Brand: Advanced Thermal Solutions
SKU: 984-ATS012012011SF2J
Price: 220.4 PHP
Availability: InStock

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Mouser #:

984-ATS012012011SF2J

Mfr. #:

ATS012012011-SF-2J

Mfr.:

Advanced Thermal Solutions

Paglalarawan:

Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Straight, No TIM, 12x12x11mm

Datasheet:

ATS012012011-SF-2J Datasheet (PDF)

ECAD Model:

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May Stock: 79

Stock:: 79 Maaaring Ipadala Agad

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Lead-Time ng Pabrika:: 13 (na) Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.

Ipasok ang Dami:

Minimum: 1 Mga Multiple: 1

Presyo ng Unit:

₱-.--

Ext. Presyo:

₱-.--

Est. Taripa:

Presyo (PHP)

Dami	Presyo ng Unit	Ext. Presyo
	₱220.40	₱220.40
	₱186.18	₱1,861.80
	₱179.22	₱8,961.00
	₱169.36	₱16,936.00
	₱161.82	₱32,364.00
	₱158.34	₱79,170.00
	₱151.96	₱151,960.00
	₱151.38	₱378,450.00
5,000	Quote

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Katangian ng Produkto	Value ng Attribute	Pumili ng Attribute
Manufacturer:	Advanced Thermal Solutions
Kategorya ng Produkto:	Mga Heat Sink
RoHS:
Produkto:	Heat Sinks
Dinesenyo para sa:	BGA
Isitilo ng Mounting:	PCB
Materyal ng Heatsink:	Aluminum
Istilo ng Fin:	Straight Fin
Thermal Resistance:	21.39 C/W
Haba:	12 mm
Lapad:	12 mm
Taas:	11 mm
Brand:	Advanced Thermal Solutions
Kulay:	Black
Packaging:	Bulk
Uri ng Produkto:	Heat Sinks
Series:	BGA High Aspect Ratio
Dami ng Pack ng Pabrika:	100
Subcategory:	Heat Sinks
Pangalang pangkalakal:	Value-Line Platform
Uri:	Component

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Mga Piniling Attribute: 0

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Datasheet

ATS012012011-SF-2J Datasheet (PDF)

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CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera^®, AMD, Freescale, Intel^®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.