EBTM-4-06-2.0-S-VT-1

Samtec
200-EBTM-4062.0SVT1
EBTM-4-06-2.0-S-VT-1

Mfr.:

Paglalarawan:
High Speed / Modular Connectors ExaMAX 2.00 mm High-Speed Backplane Vertical Header

ECAD Model:
I-download ang libreng Library Loader para i-convert ang file na ito para sa iyong ECAD Tool. Matuto nang higit pa tungkol sa ECAD Model.

May Stock: 279

Stock:
279 Maaaring Ipadala Agad
Lead-Time ng Pabrika:
1 Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.
Minimum: 1   Mga Multiple: 1
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱848.54 ₱848.54
₱775.46 ₱7,754.60
₱708.76 ₱17,719.00
₱647.86 ₱54,420.24
₱541.14 ₱136,367.28
₱497.64 ₱250,810.56
₱452.40 ₱456,019.20

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Samtec
Kategorya ng Produkto: Mga High Speed / Modular Connector
RoHS:  
Headers
48 Position
6 Row
2 mm
Solder Pin
Gold
EBTM
Tray
Brand: Samtec
Materyal ng Contact: Copper Alloy
Rating ng Current: 4.2 A
Kulay ng Housing: Black
Materyal ng Housing: Liquid Crystal Polymer (LCP)
Maximum na Operating Temperature: + 85 C
Minimum na Operating Temperature: - 55 C
Anggulo ng Mounting: Straight
Uri ng Produkto: High Speed / Modular Connectors
Dami ng Pack ng Pabrika: 42
Subcategory: Backplane Connectors
Pangalang pangkalakal: ExaMAX
Nahanap na mga produkto:
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Pumili ng kahit isang checkbox sa itaas para magpakita ng katulad na produkto sa kategoryang ito.
Mga Piniling Attribute: 0

CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

Artificial Intelligence Connectivity Solutions

Samtec Artificial Intelligence (AI) Connectivity Solutions feature an extensive portfolio of high-performance products that support next-generation system designs. These AI solutions are engineered with the complete system in mind, including architectures that demand increased speeds, frequencies, bandwidths, and densities, as well as configurability and scalability. The product lineup consists of high-speed cable assemblies, high-speed board-to-board connectors, high power and signal connectors, and RF cables, assemblies, and connectors. Samtec AI Connectivity Solutions are ideal for next-generation applications, from testing and development to full system optimization support.

ExaMAX® High-Speed Backplane System

Samtec ExaMAX® High-Speed Backplane System offers design flexibility to fit a variety of applications, including Flyover® cables supporting 112Gbps PAM4 and board-to-board connectors supporting 64Gbps PAM4. ExaMAX Backplane Systems are suitably designed for various industries, including 5G networking, medical, automotive, instrumentation, military/aerospace, and AI/machine learning.