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EBTM-6-08-2.0-S-VT-1-R

Name: Samtec EBTM-6-08-2.0-S-VT-1-R
Brand: Samtec
SKU: 200-EBTM6082.0SVT1R
Price: 1456.96 PHP
Availability: InStock

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Mouser #:

200-EBTM6082.0SVT1R

Mfr. #:

EBTM-6-08-2.0-S-VT-1-R

Mfr.:

Samtec

Paglalarawan:

High Speed / Modular Connectors ExaMAX 2.00 mm High-Speed Backplane Vertical Header

Datasheet:

EBTM-6-08-2.0-S-VT-1-R Datasheet (PDF)

ECAD Model:

I-download ang libreng Library Loader para i-convert ang file na ito para sa iyong ECAD Tool. Matuto nang higit pa tungkol sa ECAD Model.

Higit Pang Impormasyon

Alamin pa ang tungkol sa Samtec EBTM-6-08-2.0-S-VT-1-R

Availability

Stock:: May nangyaring di-inaasahang error. Subukan ulit mamaya.

35 Maaaring Ipadala sa loob ng 20 (na) Araw

Ipasok ang Dami:

Minimum: 1 Mga Multiple: 1

Presyo ng Unit:

₱-.--

Ext. Presyo:

₱-.--

Est. Taripa:

Presyo (PHP)

Dami	Presyo ng Unit	Ext. Presyo
	₱1,456.96	₱1,456.96
	₱1,331.68	₱13,316.80
	₱1,216.84	₱30,421.00
	₱1,111.86	₱55,593.00
	₱1,008.62	₱100,862.00
	₱928.00	₱232,000.00
	₱853.18	₱426,590.00
1,000	Quote

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Katangian ng Produkto	Value ng Attribute	Pumili ng Attribute
Manufacturer:	Samtec
Kategorya ng Produkto:	Mga High Speed / Modular Connector
RoHS:
Produkto:	Headers
Dami ng Posisyon:	96 Position
Dami ng Row:	8 Row
Pitch:	2 mm
Istilo ng Termination:	Solder Pin
Plating ng Contact:	Gold
Series:	EBTM
Packaging:	Tray
Brand:	Samtec
Materyal ng Contact:	Copper Alloy
Rating ng Current:	4.2 A
Kulay ng Housing:	Black
Materyal ng Housing:	Liquid Crystal Polymer (LCP)
Maximum na Operating Temperature:	+ 85 C
Minimum na Operating Temperature:	- 55 C
Anggulo ng Mounting:	Straight
Uri ng Produkto:	High Speed / Modular Connectors
Dami ng Pack ng Pabrika:	1
Subcategory:	Backplane Connectors
Pangalang pangkalakal:	ExaMAX

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Mga Piniling Attribute: 0

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Datasheet

EBTM-6-08-2.0-S-VT-1-R Datasheet (PDF)

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

Artificial Intelligence Connectivity Solutions

Samtec Artificial Intelligence (AI) Connectivity Solutions feature an extensive portfolio of high-performance products that support next-generation system designs. These AI solutions are engineered with the complete system in mind, including architectures that demand increased speeds, frequencies, bandwidths, and densities, as well as configurability and scalability. The product lineup consists of high-speed cable assemblies, high-speed board-to-board connectors, high power and signal connectors, and RF cables, assemblies, and connectors. Samtec AI Connectivity Solutions are ideal for next-generation applications, from testing and development to full system optimization support.

ExaMAX® High-Speed Backplane System

Samtec ExaMAX® High-Speed Backplane System offers design flexibility to fit a variety of applications, including Flyover® cables supporting 112Gbps PAM4 and board-to-board connectors supporting 64Gbps PAM4. ExaMAX Backplane Systems are suitably designed for various industries, including 5G networking, medical, automotive, instrumentation, military/aerospace, and AI/machine learning.