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HDTM-3-06-1-S-VT-5-R-2

Name: Samtec HDTM-3-06-1-S-VT-5-R-2
Brand: Samtec
SKU: 200-HDTM3061SVT5R2
Price: 603.78 PHP
Availability: InStock

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Mouser #:

200-HDTM3061SVT5R2

Mfr. #:

HDTM-3-06-1-S-VT-5-R-2

Mfr.:

Samtec

Paglalarawan:

High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Datasheet:

HDTM-3-06-1-S-VT-5-R-2 Datasheet (PDF)

ECAD Model:

I-download ang libreng Library Loader para i-convert ang file na ito para sa iyong ECAD Tool. Matuto nang higit pa tungkol sa ECAD Model.

Higit Pang Impormasyon

Alamin pa ang tungkol sa Samtec HDTM-3-06-1-S-VT-5-R-2

May Stock: 38

Stock:: 38 Maaaring Ipadala Agad

May nangyaring di-inaasahang error. Subukan ulit mamaya.
Lead-Time ng Pabrika:: 1 Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.

Ipasok ang Dami:

Minimum: 1 Mga Multiple: 1

Presyo ng Unit:

₱-.--

Ext. Presyo:

₱-.--

Est. Taripa:

Presyo (PHP)

Dami	Presyo ng Unit	Ext. Presyo
	₱603.78	₱603.78
	₱544.62	₱5,446.20
	₱484.88	₱12,122.00
	₱396.14	₱38,029.44
	₱355.54	₱102,395.52
	₱328.86	₱173,638.08
	₱295.22	₱297,581.76
	₱261.58	₱527,345.28

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Katangian ng Produkto	Value ng Attribute	Pumili ng Attribute
Manufacturer:	Samtec
Kategorya ng Produkto:	Mga High Speed / Modular Connector
RoHS:
Produkto:	Headers
Dami ng Posisyon:	36 Position
Dami ng Row:	6 Row
Pitch:	1.8 mm
Istilo ng Termination:	Press Fit
Plating ng Contact:	Gold
Packaging:	Tray
Brand:	Samtec
Uri ng Produkto:	High Speed / Modular Connectors
Dami ng Pack ng Pabrika:	48
Subcategory:	Backplane Connectors

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Mga Piniling Attribute: 0

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Datasheet

HDTM-3-06-1-S-VT-5-R-2 Datasheet (PDF)

Images

Larawan

Specification Sheets

Technical Resources

Test Report (PDF)

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.