AF0131CSSM30SMKA1-CP

onsemi
863-131CSSM30SMKA1CP
AF0131CSSM30SMKA1-CP

Mfr.:

Paglalarawan:
Image Sensors 1MP 1/3 CIS SO

Lifecycle:
Bagong Produkto:
Bago mula sa manufacturer na ito.
ECAD Model:
I-download ang libreng Library Loader para i-convert ang file na ito para sa iyong ECAD Tool. Matuto nang higit pa tungkol sa ECAD Model.

Availability

Stock:
3,000 Maaaring Ipadala sa loob ng 20 (na) Araw
Matagal na lead time na iniulat sa produktong ito.
Minimum: 3000   Mga Multiple: 3000
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:
LIBRENG Ipapadala ang Produktong Ito

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱3,535.10 ₱10,605,300.00

Alternatibong Packaging

Mfr. # ng Piyesa:
Packaging:
Tray
Availability:
May Stock
Presyo:
₱4,675.38
Min:
1

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
onsemi
Kategorya ng Produkto: Mga Image Sensor
Monochrome
60 fps
3.5 um x 3.5 um
Tray
Brand: onsemi
Maselan sa Moisture: Yes
Optical Format: 1/3 in
Uri ng Produkto: Image Sensors
Series: AF0131
Dami ng Pack ng Pabrika: 100
Subcategory: Sensors
Pangalang pangkalakal: Hyperlux
Nahanap na mga produkto:
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Mga Piniling Attribute: 0

USHTS:
8541491050
ECCN:
EAR99

AF013x Hyperlux™ ID 1.2MP iToF Sensors

onsemi AF013x Hyperlux™ ID 1.2MP Indirect Time of Flight (iToF) Sensors are matrix sensors for 3D imaging of fast-moving objects. The sensors feature a 1/3.2" optical format and Back-Side Illuminated (BSI) CMOS global shutter depth and imaging. onsemi AF013x iToF image sensors offer on-chip dual laser driver controls, modulation frequencies (up to 200MHz), and laser eye-safety thresholds. The AF0130 sensor version comes with a depth-processing ASIC stacked below its pixel area. This on-chip depth processing ASIC calculates depth, confidence, and intensity maps at high speeds from its laser-modulated exposures. The AF0131 is geared toward designs with off-chip depth calculation. These sensors are ideal for factory automation, computing, drones, robotics, metrology, machine vision, biometrics, future retail and intelligent logistics, and 3D modeling.