ATS-HK379-R0

Advanced Thermal Solutions
984-ATS-HK379-R0
ATS-HK379-R0

Mfr.:

Paglalarawan:
Heat Sinks Cooler Backing Plate, High Performance, 96x96x6mm, 80mm Hole to Hole, Aluminum

ECAD Model:
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May Stock: 649

Stock:
649 Maaaring Ipadala Agad
Lead-Time ng Pabrika:
13 (na) Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.
Minimum: 1   Mga Multiple: 1
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱224.46 ₱224.46
₱209.96 ₱2,099.60
₱204.16 ₱5,104.00
₱192.56 ₱9,628.00
₱181.54 ₱18,154.00
₱169.94 ₱42,485.00
₱164.14 ₱82,070.00
₱155.44 ₱155,440.00

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Advanced Thermal Solutions
Kategorya ng Produkto: Mga Heat Sink
RoHS:  
Accessories and Hardware
96 mm
96 mm
Brand: Advanced Thermal Solutions
Uri ng Produkto: Heat Sinks
Series: ATS-HK
Dami ng Pack ng Pabrika: 1
Subcategory: Heat Sinks
Uri: Backing Plate
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Mga Piniling Attribute: 0

CAHTS:
8473309000
USHTS:
8473305100
JPHTS:
847330090
MXHTS:
8473300499
ECCN:
EAR99

ATS-HK379-R0 High-Performance Cooler Backing Plate

Advanced Thermal Solutions ATS-HK379-R0 High-Performance Cooler Backing Plate is an optional backing plate that connects CPUs and other high-powered processors to the Ultra-Cool family of high-performance passive and active thermal solutions, including dual-FLOW™ and quadFLOW™. The ATS-HK379-R0 is designed for CPUs, processors, GPUs, AI processors, and FPGAs that fit sockets other than the Intel™ LGA2011 square and LGA2066 (Socket R). This plate comes with an unattached die-cut Formex GK-10 insulator to provide electrical insulation between the board and the backing plate. ATS High-Performance Cooler Backing Plate measures 96mm x 96mm with 70mm x 70mm inner dimensions and is intended for use with 1.57mm thick PCB. The ATS-HK379-R0 easily attaches beneath the PCB for even pressure across the board to prevent cracking or other damage.