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ATS-59001-C1-R0

Name: Advanced Thermal Solutions ATS-59001-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-59001-C1-R0
Price: 2145.42 PHP
Availability: InStock

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Mouser #:

984-ATS-59001-C1-R0

Mfr. #:

ATS-59001-C1-R0

Mfr.:

Advanced Thermal Solutions

Paglalarawan:

Heat Sinks maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 21mm Comp, 28x45x11mm

Datasheet:

ATS-59001-C1-R0 Datasheet (PDF)

ECAD Model:

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Higit Pang Impormasyon

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Availability

Stock:: May nangyaring di-inaasahang error. Subukan ulit mamaya.

100 Maaaring Ipadala sa loob ng 20 (na) Araw

Ipasok ang Dami:

Minimum: 100 Mga Multiple: 100

Presyo ng Unit:

₱-.--

Ext. Presyo:

₱-.--

Est. Taripa:

LIBRENG Ipapadala ang Produktong Ito

Presyo (PHP)

Dami	Presyo ng Unit	Ext. Presyo
	₱2,145.42	₱214,542.00
	₱2,043.92	₱408,784.00

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Katangian ng Produkto	Value ng Attribute	Pumili ng Attribute
Manufacturer:	Advanced Thermal Solutions
Kategorya ng Produkto:	Mga Heat Sink
RoHS:
Produkto:	Heat Sink Assemblies
Dinesenyo para sa:	BGA
Isitilo ng Mounting:	Snap On
Materyal ng Heatsink:	Aluminum
Istilo ng Fin:	maxiFLOW
Thermal Resistance:	4.5 C/W
Haba:	45 mm
Lapad:	21 mm
Taas:	11 mm
Brand:	Advanced Thermal Solutions
Kulay:	Black
Packaging:	Bulk
Uri ng Produkto:	Heat Sinks
Series:	maxiGRIP HS ASM - Custom
Dami ng Pack ng Pabrika:	100
Subcategory:	Heat Sinks
Pangalang pangkalakal:	maxiFLOW maxiGRIP
Uri:	Component

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Datasheet

ATS-59001-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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CNHTS:: 7616991090
USHTS:: 7616995190
TARIC:: 7616991099
MXHTS:: 7616995195
ECCN:: EAR99

Heat Sinks

Advanced Thermal Solutions Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW™, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.