ATS-59005-C1-R0

Advanced Thermal Solutions
984-ATS-59005-C1-R0
ATS-59005-C1-R0

Mfr.:

Paglalarawan:
Heat Sinks maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 29mm, No PED, 29x37x10mm

Datasheet:
ECAD Model:
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Availability

Stock:
100 Maaaring Ipadala sa loob ng 20 (na) Araw
Minimum: 100   Mga Multiple: 100
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:
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Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱1,491.18 ₱149,118.00
₱1,419.84 ₱283,968.00

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Advanced Thermal Solutions
Kategorya ng Produkto: Mga Heat Sink
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
maxiFLOW
6.2 C/W
37 mm
29 mm
10 mm
Brand: Advanced Thermal Solutions
Kulay: Black
Packaging: Bulk
Uri ng Produkto: Heat Sinks
Series: maxiGRIP HS ASM - Custom
Dami ng Pack ng Pabrika: 100
Subcategory: Heat Sinks
Pangalang pangkalakal: maxiFLOW maxiGRIP
Uri: Component
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Mga Piniling Attribute: 0

Datasheet

Test/Quality Data

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CNHTS:
7616991090
USHTS:
7616995190
TARIC:
7616991099
MXHTS:
7616995195
ECCN:
EAR99

Heat Sinks

Advanced Thermal Solutions Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW™, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

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