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ATS-59009-C1-R0

Name: Advanced Thermal Solutions ATS-59009-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-59009-C1-R0
Price: 1273.68 PHP
Availability: OutOfStock

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Mouser #:

984-ATS-59009-C1-R0

Mfr. #:

ATS-59009-C1-R0

Mfr.:

Advanced Thermal Solutions

Paglalarawan:

Heat Sinks maxiGRIP Heat Sink Assembly, 2 Side Adhesive, T412, 42.5mm Comp, 62x52x13mm

Datasheet:

ATS-59009-C1-R0 Datasheet (PDF)

ECAD Model:

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Availability

Stock:: Hindi Naka-stock

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Lead-Time ng Pabrika:: 13 (na) Linggo Tinatayang oras ng paggawa sa pabrika.

Ipasok ang Dami:

Minimum: 100 Mga Multiple: 100

Presyo ng Unit:

₱-.--

Ext. Presyo:

₱-.--

Est. Taripa:

LIBRENG Ipapadala ang Produktong Ito

Presyo (PHP)

Dami	Presyo ng Unit	Ext. Presyo
	₱1,273.68	₱127,368.00
	₱1,251.06	₱250,212.00
	₱1,239.46	₱619,730.00
1,000	Quote

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Katangian ng Produkto	Value ng Attribute	Pumili ng Attribute
Manufacturer:	Advanced Thermal Solutions
Kategorya ng Produkto:	Mga Heat Sink
RoHS:
Produkto:	Heat Sink Assemblies
Dinesenyo para sa:	BGA
Isitilo ng Mounting:	Snap On
Materyal ng Heatsink:	Aluminum
Istilo ng Fin:	maxiFLOW
Thermal Resistance:	3.2 C/W
Haba:	62 mm
Lapad:	52 mm
Taas:	13 mm
Brand:	Advanced Thermal Solutions
Kulay:	Black
Packaging:	Bulk
Uri ng Produkto:	Heat Sinks
Series:	maxiGRIP HS ASM - Custom
Dami ng Pack ng Pabrika:	100
Subcategory:	Heat Sinks
Pangalang pangkalakal:	maxiFLOW maxiGRIP
Uri:	Component

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Mga Piniling Attribute: 0

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Datasheet

ATS-59009-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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CNHTS:: 7616991090
USHTS:: 7616995190
TARIC:: 7616991099
MXHTS:: 7616995195
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.