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DF65-3S-1.7C

Name: Hirose Electric DF65-3S-1.7C
Brand: Hirose Connector
SKU: 798-DF65-3S-1.7C
Price: 11.6 PHP
Availability: InStock

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Mouser #:

798-DF65-3S-1.7C

Mfr. #:

DF65-3S-1.7C

Mfr.:

Hirose Connector

Paglalarawan:

Power to the Board 1.7mm Low Profile BtW Socket 3P

Datasheet:

DF65-3S-1.7C Datasheet (PDF)

ECAD Model:

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Higit Pang Impormasyon

Alamin pa ang tungkol sa Hirose Connector DF65-3S-1.7C

May Stock: 6,450

Stock:: 6,450 Maaaring Ipadala Agad

May nangyaring di-inaasahang error. Subukan ulit mamaya.
Lead-Time ng Pabrika:: 7 (na) Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.

Ipasok ang Dami:

Minimum: 1 Mga Multiple: 1

Presyo ng Unit:

₱-.--

Ext. Presyo:

₱-.--

Est. Taripa:

Presyo (PHP)

Dami	Presyo ng Unit	Ext. Presyo
	₱11.60	₱11.60
	₱9.40	₱94.00
	₱8.47	₱211.75
	₱8.06	₱806.00
	₱7.19	₱2,157.00
	₱6.84	₱6,840.00
	₱6.44	₱16,100.00
	₱5.57	₱55,700.00
	₱5.16	₱103,200.00

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Katangian ng Produkto	Value ng Attribute	Pumili ng Attribute
Manufacturer:	Hirose Electric
Kategorya ng Produkto:	Power sa may Board
RoHS:
Uri ng Produkto:	Power to the Board
Gender ng Contact:	Socket (Female)
Rating ng Current:	4 A
Rating ng Voltage:	50 V
Dami ng Posisyon:	3 Position
Isitilo ng Mounting:	Cable Mount / Free Hanging
Istilo ng Termination:	Crimp
Pitch:	1.7 mm
Series:	DF65
Packaging:	Bulk
Pangalang pangkalakal:	SnapBee
Brand:	Hirose Connector
Materyal ng Contact:	Phosphor Bronze
Plating ng Contact:	Tin
Kulay ng Housing:	Beige
Materyal ng Housing:	Liquid Crystal Polymer (LCP)
Insulation Resistance:	100 MOhms
Maximum na Operating Temperature:	+ 105 C
Minimum na Operating Temperature:	- 40 C
Anggulo ng Mounting:	Vertical
Dami ng Row:	1 Row
Produkto:	Sockets
Dami ng Pack ng Pabrika:	100
Subcategory:	Power Connectors
Gauge ng Wire Max:	24 AWG
Gauge ng Wire Min:	28 AWG
Range ng Gauge ng Wire:	28 AWG to 24 AWG
Mga Alias ng # ng Piyesa :	666-6005-8-00
Timbang ng Unit:	300 mg

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Mga Piniling Attribute: 0

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Datasheet

DF65-3S-1.7C Datasheet (PDF)

Models

Product Catalogs

Catalog Page

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CNHTS:: 8547200000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

DF65 1.7mm Pitch Board-to-Wire Connectors

Hirose Electric DF65 1.7mm Pitch Board-to-Wire Connectors are low-profile components featuring enhanced contact reliability and locking structure. The locking structure reinforces the connection between the wire side and the header. This secure connection prevents misalignment of the wire side due to improper wire routing. DF65 connectors offer a vertical mating style that reduces assembly time and maximizes board space. The two-point contact structure of Hirose DF65 Connectors provides high reliability, a low mated height of 1.8mm, and an effective mating length of 0.35mm. The DF65 1.7mm Pitch Board-to-Wire Connectors are ideal for use in power supplies.

Smartphone & PC Solutions

Hirose Electric offers ultra-fine pitch solutions with dimensions down to 0.25mm, supporting small form factors without sacrificing performance. These solutions feature high-speed data, high-current delivery, EMI control, and rugged locking mechanisms, ensuring reliable operation. Hirose connectors meet rigorous demands in sleek, space-constrained designs where durability, precision, and signal integrity are crucial. Suitable applications include displays, batteries, cameras, antennas, USB interfaces, and touch functionality.

Medical Solutions

Hirose Electric Medical Solutions include high-performance connectors engineered for precision, durability, and reliability in demanding applications. Products offered include board-to-board, wire-to-board, FPC/FFC, circular, and coaxial connectors with IP67/IP68 sealing to protect against debris, dust, and moisture ingress. Features include EMI shielding, extended mating cycles, and secure locking, ensuring stable interference-free performance. The miniaturized products from Hirose support compact, high-density systems, while hybrid signal/power designs and RoHS/IEC compliance meet the evolving needs of diagnostic imaging, patient monitoring, therapy systems, and wearable medical tech.