TD160N16SOFHPSA1

Infineon Technologies
726-TD160N16SOFHPSA1
TD160N16SOFHPSA1

Mfr.:

Paglalarawan:
Discrete Semiconductor Modules L#T-BOND MODULE

ECAD Model:
I-download ang libreng Library Loader para i-convert ang file na ito para sa iyong ECAD Tool. Matuto nang higit pa tungkol sa ECAD Model.

May Stock: 1

Stock:
1 Maaaring Ipadala Agad
Lead-Time ng Pabrika:
24 (na) Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.
Minimum: 1   Mga Multiple: 1
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:
LIBRENG Ipapadala ang Produktong Ito

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱2,947.56 ₱2,947.56
₱2,552.58 ₱20,420.64
₱2,128.60 ₱51,086.40
₱2,110.04 ₱219,444.16

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Infineon
Kategorya ng Produkto: Mga Module ng Discrete Semiconductor
RoHS:  
Thyristor-Diode Modules
Phase Control
Si
1.6 kV
Screw Mount
PB34
- 40 C
+ 125 C
Tray
Brand: Infineon Technologies
Kumpigurasyon: SCR/Diode Phase Control
Gate Trigger Current - Igt: 145 mA
Holding Current Ih Max: 200 mA
Id - Continuous Drain Current: 30 mA
Uri ng Produkto: Discrete Semiconductor Modules
Dami ng Pack ng Pabrika: 8
Subcategory: Discrete and Power Modules
Karaniwang Tagal ng Delay: 2 us
Karaniwang Tagal ng Delay ng Pag-off: 320 us
Mga Alias ng # ng Piyesa : TD160N16SOF SP001495444
Timbang ng Unit: 165 g
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Mga Piniling Attribute: 0

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CAHTS:
8541300000
USHTS:
8541300080
JPHTS:
854130000
TARIC:
8541300000
ECCN:
EAR99

Eco Block Solder Bond Modules

Infineon Eco Block Solder Bond Modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications are drives, power supplies, and soft starters. Designers benefit from improved terminal design for symmetric current sharing and the 100% x-ray monitoring of solder process which leads to predictably high performance and lifetime. With the second generation for 34mm, you can get increased current ratings (up to 240A).

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.