Lahat ng Resulta (1,059)

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Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS
JUMPtec 34006-0000-99-2
JUMPtec Heat Sinks HSP COMe-mBT10 slim thread
3Inaasahan 2/26/2026
Min.: 1
Mult.: 1

JUMPtec 38017-0000-00-5
JUMPtec Computer-On-Modules - COM JUMPtec COMe Mount Kit 5mm 1set
4Inoorder
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-CSA-B
congatec CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
2Inaasahan 5/5/2026
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-CSA-T
congatec CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.
2Inaasahan 5/5/2026
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-CSP-B
congatec CPU & Chip Coolers Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.
2Inaasahan 5/5/2026
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-HSP-B
congatec Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.
2Inaasahan 5/5/2026
Min.: 1
Mult.: 1

congatec conga-TCR8/8845HS
congatec Computer-On-Modules - COM COM Express Type 6 Compact module based on AMD Ryzen Embedded 8845HS with 8 cores 3.8GHz up to 5.1GHz (boost) Integrated XDNA NPU Integrated RDNA 3 Graphics 24MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial temp
1Inaasahan 1/22/2027
Min.: 1
Mult.: 1

congatec CONGA-HPC/EVAL-MINI
congatec congatec Evaluation Carrier Board for COM-HPC Mini modules.
1Inoorder
Min.: 1
Mult.: 1
congatec Heat Sinks * Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

JUMPtec Computer-On-Modules - COM JUMPtec COMe-mEL10 E2 x6425RE 8G/32G 5Available ang Stock ng Pabrika
Min.: 1
Mult.: 1

JUMPtec Computer-On-Modules - COM JUMPtec COMe-mBTi10 E3825 2GB Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 1
Mult.: 1

JUMPtec Computer-On-Modules - COM JUMPtec COMe-cAL6 N3350 Lead-Time para sa Hindi Naka-stock 6 (na) Linggo
Min.: 1
Mult.: 1

JUMPtec Development Boards & Kits - x86 SMARC Evaluation Carrier 2.1 Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM Qseven 2.0 module based on Intel Atom x5 E3930 SoC (Dual-core, 6.5W TDP, CPU freq. 1.3/1.8GHz, GPU 12EU freq. 400/550MHz) with on-board memory 2GB DDR3L-1866 and 16GB eMMC. Lead-Time para sa Hindi Naka-stock 9 (na) Linggo
Min.: 1
Mult.: 1

congatec Heat Sinks * Standard passive cooling for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

congatec Heat Sinks * Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded. Lead-Time para sa Hindi Naka-stock 2 (na) Linggo
Min.: 1
Mult.: 1

congatec Heat Sinks Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded. Lead-Time para sa Hindi Naka-stock 12 (na) Linggo
Min.: 1
Mult.: 1
congatec Computer-On-Modules - COM Qseven module with ultra low power Freescale ARM Cortex A9 dual core 800MHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Lidded FCBGA package. Industrial grade temperature range from -40 C to 85 C. Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.6GHz +1x ARM Cortex-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40 C to 85 C. Lead-Time para sa Hindi Naka-stock 6 (na) Linggo
Min.: 1
Mult.: 1
congatec Heat Sinks Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are M2.5mm thread. Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 1
Mult.: 1
congatec Heat Sinks * Standard heatspreader for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are bore hole 2.7mm Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

congatec Heat Sinks *Heatspreader for Pico ITX board conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1
congatec CPU & Chip Coolers Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are M2.5 threaded Lead-Time para sa Hindi Naka-stock 12 (na) Linggo
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM SMARC 2.0 module with Intel Atom x7-E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz, 2MB L2 cache, 8GB 2400MT/s LPDDR4 onboard memory and 32GB eMMC onboard flash. Lead-Time para sa Hindi Naka-stock 9 (na) Linggo
Min.: 1
Mult.: 1

congatec Heat Sinks Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 1
Mult.: 1