EasyPACK™ CoolSiC™ Trench MOSFET Modules

Infineon Technologies EasyPACK™ CoolSiC™ Trench MOSFET Modules feature PressFIT contact technology and an integrated Negative Temperature Coefficient (NTC) temperature sensor. These modules operate at a 1200V drain-source voltage, feature a low inductive design, low switching losses, and high current density. The EasyPACK™ modules offer rugged mounting due to integrated mounting clamps and are packaged with a CTI >600. Applications include high-frequency switching devices, DC/DC converters, and DC chargers for EVs. With the Easy 2C Series, Infineon enhances high-power designs using SiC G2 technology and advanced .XT features. The .XT technology provides enhanced ruggedness and extended operating temperatures, while the second-generation SiC MOSFET technology offers improved gate oxide reliability and reduced on-resistance.

Mga Uri ng Discrete Semiconductor
Baguhin ang category view
Mga Resulta: 9
Pumili Larawan # ng Piyesa
 Mfr.
Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami.
Dami RoHS Uri ng Produkto
Teknolohiya
Isitilo ng Mounting
Infineon Technologies MOSFET Modules EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
Datasheet
35May Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Datasheet
16May Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor and high current PressFIT contact technology
Datasheet
23May Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Datasheet
30May Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
Datasheet
19May Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Datasheet
4May Stock
18Inaasahan 8/18/2026
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC
Datasheet
15May Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC
Datasheet
3May Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies Discrete Semiconductor Modules EasyPACK module with CoolSiC Trench MOSFET and High Current Pin / NTC
Datasheet
9May Stock
16Inaasahan 7/3/2026
Min.: 1
Mult.: 1

Discrete Semiconductor Modules SiC Press Fit