IRFB4020PBF

Infineon Technologies
942-IRFB4020PBF
IRFB4020PBF

Mfr.:

Paglalarawan:
MOSFETs MOSFT 200V 100mOhm 18A 18nC Qg for Aud

ECAD Model:
I-download ang libreng Library Loader para i-convert ang file na ito para sa iyong ECAD Tool. Matuto nang higit pa tungkol sa ECAD Model.

May Stock: 4,320

Stock:
4,320 Maaaring Ipadala Agad
Lead-Time ng Pabrika:
20 (na) Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.
Minimum: 1   Mga Multiple: 1
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱107.88 ₱107.88
₱51.74 ₱517.40
₱46.23 ₱4,623.00
₱36.66 ₱18,330.00
₱33.52 ₱33,520.00
₱32.77 ₱65,540.00

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Infineon
Kategorya ng Produkto: Mga MOSFET
RoHS:  
Si
Through Hole
TO-220-3
N-Channel
1 Channel
200 V
18 A
100 mOhms
- 20 V, 20 V
1.8 V
18 nC
- 55 C
+ 175 C
100 W
Enhancement
Tube
Brand: Infineon Technologies
Kumpigurasyon: Single
Bansa ng Pag-assemble: CN
Bansa ng Diffusion: US
Bansang Pinagmulan: KR
Tagal ng Pagbagsak: 6.3 ns
Forward Transconductance - Min: 24 S
Uri ng Produkto: MOSFETs
Tagal ng Pagtaas: 12 ns
Dami ng Pack ng Pabrika: 1000
Subcategory: Transistors
Uri ng Transistor: 1 N-Channel
Karaniwang Tagal ng Delay ng Pag-off: 16 ns
Karaniwang Tagal ng Delay ng Pag-on: 7.8 ns
Timbang ng Unit: 2 g
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Mga Piniling Attribute: 0

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CNHTS:
8541290000
CAHTS:
8541290000
USHTS:
8541290065
JPHTS:
8541290100
KRHTS:
8541299000
TARIC:
8541290000
MXHTS:
85412999
ECCN:
EAR99

Power MOSFETs

Infineon pioneered HEXFET power MOSFET technology, developing and introducing the first hexagonal topology MOSFETs in 1979. These developments were granted a broad patent just four years later, and since that time, most MOSFET manufacturers have licensed the designs and processes to enter this marketplace. IR products exhibit the lowest MOSFET on-resistance available on the market for similar components in their class, enabling power conversion subsystem designs that exhibit unequaled efficiency. IR combines state-of-the-art silicon technology with innovative packaging technology. IR POWIRTAB™, Super-220™, and Super-247™ packages allow up to 20A more current per device in the same footprint than standard packages, increasing power density. Compatible with standard surface-mount soldering techniques, IR's FlipFET® packaging technology offers a 100% silicon-to-footprint ratio with the same performance as a conventional package three times as big, making it the ideal solution for portable devices such as phones or notebook PCs. IR's DirectFET® packaging revolutionizes thermal management in the footprint of a standard SO-8 by drawing heat away from the board through the top of the package. As a result, DirectFET MOSFETs can double the current density while cutting thermal management costs in half in high-current circuits that power next-generation microprocessors.

200V to 250V HEXFET® Power MOSFETs

Infineon 200V to 250V HEXFET® Power MOSFETs offer a broad range of MOSFETs in various packages, current and RDS(on) ratings. These 200V to 250V HEXFET Power MOSFETs utilize the latest processing techniques to achieve low on-resistance per silicon area. This benefit, combined with fast switching speed and ruggedized device design provides an extremely efficient and reliable device for use in a wide variety of applications.