900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.

Mga Resulta: 145
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Dinesenyo para sa Isitilo ng Mounting Materyal ng Heatsink Istilo ng Fin Thermal Resistance Haba Lapad Taas
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 19mm Chip Size, 14.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 19mm Clip Aluminum Pin Fin 19 mm 19 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 19mm Chip Size, 17.6mm Height, Aluminum Hindi Naka-stock
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 19mm Clip Aluminum Pin Fin 19 mm 19 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 19mm Chip Size, 20.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 19mm Clip Aluminum Pin Fin 19 mm 19 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 19mm Chip Size, 27.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 19mm Clip Aluminum Pin Fin 19 mm 19 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 19mm Chip Size, 32.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 19mm Clip Aluminum Pin Fin 19 mm 19 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink, Pin Fin, 37mm Chip Size, 11.6mm Height, Aluminum Hindi Naka-stock
Min.: 180
Mult.: 45

Heat Sink Assemblies Component, 37mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink, Pin Fin, 37mm Chip Size, 17.6mm Height, Aluminum Hindi Naka-stock
Min.: 180
Mult.: 45

Heat Sink Assemblies Component, 37mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink, Pin Fin, 37mm Chip Size, 22.6mm Height, Aluminum Hindi Naka-stock
Min.: 180
Mult.: 45

Heat Sink Assemblies Component, 37mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 10mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 19mm Clip Aluminum Elliptical Pin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 21mm Chip Size, 11.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 21mm Clip Aluminum Omnidirectional Fin 21 mm 21 mm 11.6 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 21mm Chip Size, 14.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 21mm Clip Aluminum Omnidirectional Fin 21 mm 21 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 21mm Chip Size, 17.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 21mm Clip Aluminum Omnidirectional Fin 21 mm 21 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 21mm Chip Size, 20.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 21mm Clip Aluminum Omnidirectional Fin 21 mm 21 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 21mm Chip Size, 22.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 21mm Clip Aluminum Omnidirectional Fin 21 mm 21 mm 22.65 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 21mm Chip Size, 27.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 21mm Clip Aluminum Omnidirectional Fin 21 mm 21 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 21mm Chip Size, 32.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 21mm Clip Aluminum Omnidirectional Fin 21 mm 21 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 21mm Chip Size, 17.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 21mm Clip Aluminum Pin Fin 21 mm 21 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 21mm Chip Size, 20.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 21mm Clip Aluminum Pin Fin 21 mm 21 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 21mm Chip Size, 27.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 21mm Clip Aluminum Pin Fin 21 mm 21 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 21mm Chip Size, 32.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 21mm Clip Aluminum Pin Fin 21 mm 21 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 23mm Chip Size, 11.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 23mm Clip Aluminum Omnidirectional Fin 11.6 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 23mm Chip Size, 14.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 23mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 23mm Chip Size, 17.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 23mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 23mm Chip Size, 20.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 23mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 23mm Chip Size, 22.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 23mm Clip Aluminum Omnidirectional Fin 22.65 mm