900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.

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Dami RoHS ECAD Model Produkto
Dinesenyo para sa
Isitilo ng Mounting
Materyal ng Heatsink
Istilo ng Fin
Thermal Resistance
Haba
Lapad
Taas
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 23mm Chip Size, 27.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 23mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 23mm Chip Size, 32.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 23mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 23mm Chip Size, 11.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 23mm Clip Aluminum Pin Fin 11.6 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 23mm Chip Size, 17.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 23mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 23mm Chip Size, 20.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 23mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 23mm Chip Size, 22.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 23mm Clip Aluminum Pin Fin 22.65 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 23mm Chip Size, 27.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 23mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 23mm Chip Size, 32.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 23mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 27mm Chip Size, 14.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 27mm Clip Aluminum Omnidirectional Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 27mm Chip Size, 17.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 27mm Clip Aluminum Omnidirectional Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 27mm Chip Size, 20.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 27mm Clip Aluminum Omnidirectional Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 27mm Chip Size, 27.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 27mm Clip Aluminum Omnidirectional Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 27mm Chip Size, 32.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 27mm Clip Aluminum Omnidirectional Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 27mm Chip Size, 14.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 27mm Clip Aluminum Pin Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 27mm Chip Size, 17.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 27mm Clip Aluminum Pin Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 27mm Chip Size, 20.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 27mm Clip Aluminum Pin Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 27mm Chip Size, 27.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 27mm Clip Aluminum Pin Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 27mm Chip Size, 32.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 27mm Clip Aluminum Pin Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 29mm Chip Size, 11.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 29mm Clip Aluminum Omnidirectional Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 29mm Chip Size, 14.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 29mm Clip Aluminum Omnidirectional Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 29mm Chip Size, 17.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 29mm Clip Aluminum Omnidirectional Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 29mm Chip Size, 20.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 29mm Clip Aluminum Omnidirectional Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 29mm Chip Size, 22.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 29mm Clip Aluminum Omnidirectional Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 29mm Chip Size, 32.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 29mm Clip Aluminum Omnidirectional Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 29mm Chip Size, 11.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 29mm Clip Aluminum Pin Fin 27 mm 27 mm