900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.

Mga Resulta: 145
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Dinesenyo para sa Isitilo ng Mounting Materyal ng Heatsink Istilo ng Fin Thermal Resistance Haba Lapad Taas
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 29mm Chip Size, 14.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 29mm Clip Aluminum Pin Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 29mm Chip Size, 17.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 29mm Clip Aluminum Pin Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 29mm Chip Size, 20.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 29mm Clip Aluminum Pin Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 29mm Chip Size, 22.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 29mm Clip Aluminum Pin Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink, Elliptical, 29mm Chip Size, 27.6mm Height, Aluminum Hindi Naka-stock
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 29mm Clip Aluminum Omnidirectional Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 29mm Chip Size, 32.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 29mm Clip Aluminum Pin Fin 27 mm 27 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 29mm Chip Size, 29mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 29mm Spring Screw Aluminum Pin Fin 8.84 C/W 27.6 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 31mm Chip Size, 14.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 31mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 31mm Chip Size, 17.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 31mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 31mm Chip Size, 20.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 31mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 31mm Chip Size, 31.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 31mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 31mm Chip Size, 32.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 31mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 31mm Chip Size, 11.6mm Height, Aluminum Lead-Time 16 (na) Linggo
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 31mm Clip Aluminum Elliptical Pin 31 mm 31 mm 11.6 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 31mm Chip Size, 17.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 31mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 31mm Chip Size, 20.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 31mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 31mm Chip Size, 22.6mm Height, Aluminum Lead-Time 16 (na) Linggo
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 31mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 31mm Chip Size, 31.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 31mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 31mm Chip Size, 32.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 31mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 33mm Chip Size, 11.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 33mm Chip Size, 14.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 33mm Chip Size, 17.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 33mm Chip Size, 20.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 33mm Chip Size, 22.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 33mm Chip Size, 33.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 33mm Chip Size, 32.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Omnidirectional Fin