900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.

Mga Resulta: 145
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Dinesenyo para sa Isitilo ng Mounting Materyal ng Heatsink Istilo ng Fin Thermal Resistance Haba Lapad Taas
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 11.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 14.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 17.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 20.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 22.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 33.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 32.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 11.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 14.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 17.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 20.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 22.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 35.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 32.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 35mm Chip Size, 14.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 35mm Chip Size, 20.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 35mm Chip Size, 35.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 35mm Chip Size, 32.6mm Height, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink wClip, Pin Fin, 35mm Chip Size, 22.6mm (H), 0.9-2.1mm Chip (H) Hindi Naka-stock
Min.: 1
Mult.: 1

Heat Sinks BGA Press Fit Aluminum Pin Fin 8.75 C/W 22.6 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 11.6mm H, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 14.6mm H, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 17.6mm H, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 20.6mm H, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 22.6mm H, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 27.6mm H, Aluminum Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum