900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.

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Dinesenyo para sa
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Materyal ng Heatsink
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Thermal Resistance
Haba
Lapad
Taas
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 32.6mm H, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 37mm Chip Size, 11.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 37mm Chip Size, 14.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 37mm Chip Size, 17.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 37mm Chip Size, 20.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 37mm Chip Size, 22.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 37mm Chip Size, 27.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 37mm Chip Size, 32.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 40mm Chip Size, 11.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 40mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 40mm Chip Size, 14.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 40mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 40mm Chip Size, 17.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 40mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 40mm Chip Size, 20.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 40mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 40mm Chip Size, 22.6mm Height, Aluminum
Datasheet
Lead-Time 16 (na) Linggo
Min.: 1
Mult.: 1

Heat Sink Assemblies Component, 40mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 40mm Chip Size, 40.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 40mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 40mm Chip Size, 32.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 40mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 40mm Chip Size, 14.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 40mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 40mm Chip Size, 17.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 40mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 40mm Chip Size, 20.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 40mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 40mm Chip Size, 40.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 40mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 40mm Chip Size, 32.6mm Height, Aluminum
Datasheet
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 40mm Clip Aluminum Pin Fin