Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

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Thermal Conductivity
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Laird Technologies Thermal Interface Products Tputty 502 40 FG2 18x18" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Thermally Conductive Adhesives Boron Nitride 3 W/m-K 4 kVAC White - 45 C + 200 C 1.02 mm Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 50 FG2 9x9" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 8
Mult.: 1

Thermally Conductive Adhesives Thermal Pad Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 229 mm 229 mm 1.27 mm 10 psi UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 50 FG2 18x18" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 60 FG2 18x18" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Thermally Conductive Adhesives Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 457 mm 457 mm 2.03 mm UL 94 HB Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 70 FG2 9x9" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 5
Mult.: 1

Thermally Conductive Adhesives Boron Nitride 3 W/m-K White - 45 C + 200 C 0.5 mm to 5 mm Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 70 FG2 18x18" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Thermally Conductive Adhesives Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 457 mm 457 mm 1.778 mm UL 94 HB Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 80 FG2 18x18" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 90 FG2 18x18" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 90 FG2 9x9" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

Thermally Conductive Adhesives Thermal Pad Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 229 mm 229 mm 2.28 mm 10 psi UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502,FG2,100 9" x 9"
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 229 mm 229 mm 2.54 mm 10 psi UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502,FG2,110 9" x 9"
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Boron Nitride 3 W/m-K White - 45 C + 200 C 229 mm 229 mm 2.79 mm 10 psi UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 FG2 120 9" x 9"
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 229 mm 229 mm 0.12 in UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 130 FG2 9x9" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 140 FG2 9x9" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 150 FG2 9x9" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 160 FG2 9x9" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

Thermally Conductive Adhesives Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 229 mm 229 mm Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 170 FG2 9x9" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 180 FG2 9x9" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 180 FG2 18x18" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 190 FG2 9x9" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 200 FG2 9x9" 3W/mK XSoft
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Thermally Conductive Adhesives Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 2.54 mm Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tpli 215 FG A1 8x8" 6 W/mK gap filler
Datasheet
Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Non-standard 6 W/m-K Tpli 200 Bulk
Laird Technologies Thermal Interface Products 8x8x0.015",T-pli 215AO,Gasket
Datasheet
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 10
Mult.: 1

Gap Fillers / Gap Pads / Sheets Non-standard Tpli 200
Laird Technologies Thermal Interface Products Tpli215 FG A0 16x16" 6 W/mK gap filler
Datasheet
Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Non-standard 6 W/m-K Tpli 200 Bulk
Laird Technologies Thermal Interface Products Tpli 225,A1 16" x 16"
Datasheet
Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets Non-standard 6 W/m-K Tpli 200 Bulk