AMPMODU 1.0mm Centerline Interconnect System

Ang (TE) AMPMODU 1.0mm Centerline Interconnect System ng TE Connectivity ay nag-aalok ng 85% na space saving kumpara sa standard na mga 2.54mm pitch connector. Ang dual-beam contact design ay naglalaan ng maaasahang electrical connection kahit na sa mga kapaligirang may matinding shock o vibration. Ang (TE) AMPMODU 1.0mm Centerline Interconnect System ay magagamit para sa maraming iba't ibang design requirement na may hanggang 100 posisyon at dalawang plating option na may suporta para sa automated surface mounting at mga reflow process.

Mga Resulta: 188
Pumili Larawan # ng Piyesa
 Mfr.
Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami.
Dami RoHS ECAD Model Produkto
Dami ng Posisyon
Pitch
Dami ng Row
Istilo ng Termination
Anggulo ng Mounting
Taas ng Stack
Rating ng Current
Rating ng Voltage
Minimum na Operating Temperature
Maximum na Operating Temperature
Plating ng Contact
Materyal ng Contact
Materyal ng Housing
Packaging
TE Connectivity Board to Board & Mezzanine Connectors 2x4P TB HDR VT (180) 3.5, BK
Datasheet
Lead-Time para sa Hindi Naka-stock 14 (na) Linggo
Min.: 900
Mult.: 900
Reel: 900

Headers 80 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 100 SMT G1 TBK
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 210
Mult.: 210

Headers 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 4.3 mm 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors 2x6P Spring TB Plug w/ Flg 3.5, BK
Datasheet
Hindi Naka-stock
Min.: 900
Mult.: 900
Reel: 900

Headers 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 4.3 mm 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 100 SMT G3 TBK
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 210
Mult.: 210

Headers 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors 2x6P Spring TB Plug w/ SL 3.5, BK
Datasheet
Hindi Naka-stock
Min.: 900
Mult.: 900
Reel: 900

Headers 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 2x9P Spring TB Plug w/ SL 3.5, BK
Datasheet
Hindi Naka-stock
Min.: 900
Mult.: 900
Reel: 900

Receptacles 26 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 3P TB HDR HZ (90) 2.50, GN
Datasheet
Hindi Naka-stock
Min.: 900
Mult.: 900
Reel: 900

Receptacles 26 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 3P TB HDR VT (180) 2.50, GN
Datasheet
Hindi Naka-stock
Min.: 900
Mult.: 900
Reel: 900

Receptacles 32 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 3P TB HDR VT (180) 3.5, GN
Datasheet
Hindi Naka-stock
Min.: 900
Mult.: 900
Reel: 900

Receptacles 32 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 5P Spring TB Plug 2.50, GN
Datasheet
Hindi Naka-stock
Min.: 900
Mult.: 900
Reel: 900

Receptacles 68 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Reel
TE Connectivity Board to Board & Mezzanine Connectors 5P Spring TB Plug 3.5, GN
Datasheet
Hindi Naka-stock
Min.: 900
Mult.: 900
Reel: 900

Receptacles 68 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Reel
TE Connectivity Board to Board & Mezzanine Connectors 6P TB HDR VT (180) 3.5, GN
Datasheet
Hindi Naka-stock
Min.: 810
Mult.: 810
Reel: 810

Receptacles 80 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 6P TB HDR VT (180) 3.81, GN
Datasheet
Hindi Naka-stock
Min.: 810
Mult.: 810
Reel: 810

Receptacles 80 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 7P TB HDR VT (180) 3.5, GN
Datasheet
Hindi Naka-stock
Min.: 810
Mult.: 810
Reel: 810

Receptacles 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors 7P TB HDR VT (180) 3.81, GN
Datasheet
Hindi Naka-stock
Min.: 810
Mult.: 810
Reel: 810

Receptacles 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 040 SMT G1 TBK
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 525
Mult.: 525

Headers 40 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 040 SMT G3 TBK
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 525
Mult.: 525

Headers 40 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 100 SMT G1 TBK
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 210
Mult.: 210

Headers 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 012 SMT G1 TBK
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 1,680
Mult.: 1,680

Headers 12 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 016 SMT G1 TBK
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 1,260
Mult.: 1,260

Headers 16 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 100 SMT G3 TBK
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 210
Mult.: 210

Headers 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 012 SMT G3 TBK
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 1,680
Mult.: 1,680

Headers 12 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 016 SMT G3 TBK
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 1,260
Mult.: 1,260

Headers 16 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 068 SMT G1 TBK
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 315
Mult.: 315

Headers 68 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 068 SMT G3 TBK
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 315
Mult.: 315

Headers 68 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube