AMPMODU 1.0mm Centerline Interconnect System

Ang (TE) AMPMODU 1.0mm Centerline Interconnect System ng TE Connectivity ay nag-aalok ng 85% na space saving kumpara sa standard na mga 2.54mm pitch connector. Ang dual-beam contact design ay naglalaan ng maaasahang electrical connection kahit na sa mga kapaligirang may matinding shock o vibration. Ang (TE) AMPMODU 1.0mm Centerline Interconnect System ay magagamit para sa maraming iba't ibang design requirement na may hanggang 100 posisyon at dalawang plating option na may suporta para sa automated surface mounting at mga reflow process.

Mga Resulta: 188
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Dami ng Posisyon Pitch Dami ng Row Istilo ng Termination Anggulo ng Mounting Taas ng Stack Rating ng Current Rating ng Voltage Minimum na Operating Temperature Maximum na Operating Temperature Plating ng Contact Materyal ng Contact Materyal ng Housing Packaging
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 032 SMT G3 TR Lead-Time para sa Hindi Naka-stock 14 (na) Linggo
Min.: 900
Mult.: 900
Reel: 900

Headers 32 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 040 SMT G1 TR Lead-Time para sa Hindi Naka-stock 14 (na) Linggo
Min.: 900
Mult.: 900

Bulk
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 050 SMT G1 TR Lead-Time para sa Hindi Naka-stock 14 (na) Linggo
Min.: 900
Mult.: 900
Reel: 900

Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 040 SMT G3 TR Lead-Time para sa Hindi Naka-stock 14 (na) Linggo
Min.: 900
Mult.: 900
Reel: 900

Headers 40 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 050 SMT G3 TR Lead-Time para sa Hindi Naka-stock 14 (na) Linggo
Min.: 900
Mult.: 900
Reel: 900

Headers 50 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 RCPT DR VT 068 SMT G3 TR Hindi Naka-stock
Min.: 900
Mult.: 900
Reel: 900

Receptacles 68 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 RCPT DR VT 068 SMT G1 TR Hindi Naka-stock
Min.: 900
Mult.: 900
Reel: 900

Receptacles 68 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 068 SMT G1 TR Lead-Time para sa Hindi Naka-stock 14 (na) Linggo
Min.: 900
Mult.: 900
Reel: 900

Headers 68 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 068 SMT G3 TR Lead-Time para sa Hindi Naka-stock 14 (na) Linggo
Min.: 900
Mult.: 900
Reel: 900

Headers 68 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 RCPT DR VT 080 SMT G3 TR Hindi Naka-stock
Min.: 810
Mult.: 810
Reel: 810

Receptacles 80 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 RCPT DR VT 080 SMT G1 TR Hindi Naka-stock
Min.: 810
Mult.: 810
Reel: 810

Receptacles 80 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 080 SMT G1 TR Lead-Time para sa Hindi Naka-stock 14 (na) Linggo
Min.: 900
Mult.: 900
Reel: 900

Reel
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 080 SMT G3 TR Lead-Time para sa Hindi Naka-stock 14 (na) Linggo
Min.: 900
Mult.: 900
Reel: 900

Headers 80 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel