Mga Data Center Application

Ang mga Bergquist Company Data Center Application ay nagtatampok ng mga advanced material na nakakatulong sa thermal management, long-term reliability, at stress protection. Nadaragdagan ang mga data center speed at volume habang nagiging popular ang analytics, artificial intelligence (AI), at high-performance computing. Dahil sa tumaas na demand na ito, nagiging mas mainit ang mga next-generation data center, at puwedeng makaapekto sa performance ang init na ito. Ang Bergquist Company ay nagdidisenyo at nagma-manufacture ng mga component-level na thermal management at stress protection product, na tumutulong para matugunan ang tumitinding mga performance requirement.

Mga Resulta: 211
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Uri Package / Case Materyal Thermal Conductivity Breakdown Voltage Kulay Minimum na Operating Temperature Maximum na Operating Temperature Haba Lapad Kapal Tensile Strength Rating ng Flammability Series Packaging
Bergquist Company 2340940
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 1500 / 1500 Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

1500 / TGF 1500
Bergquist Company 2353072
Bergquist Company Thermal Interface Products Gap Filler (2-Part), No Spacer Beads, Pot Life=60m, 3.6 W/m-K, Dual Cartridge Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 2
Mult.: 1

3500S35 / TGF 3600
Bergquist Company 2360801
Bergquist Company Thermal Interface Products Gap Filler (2-Part), No Spacer Beads, Pot Life=60m, 3.6 W/m-K, Dual Cartridge Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 16
Mult.: 1

3500S35 / TGF 3600
Bergquist Company 2367978
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 1500 / 1500 Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 3
Mult.: 1

1500 / TGF 1500
Bergquist Company 2397652
Bergquist Company Thermal Interface Products Liqui-Bond EA 1805 Conductive, 2-Part, Liquid Epoxy Adhesive Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 1
Mult.: 1

EA 1805 / TLB EA1800
Bergquist Company 2415809
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 4000 / 4000 Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

4000 / TGF 4000
Bergquist Company 2427185
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 13
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2427191
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 2
Mult.: 1

4000 / TGF 4000
Bergquist Company 2456488
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Tube, Gap Filler TGF 3500LVO / 3500LV Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2474900
Bergquist Company Thermal Interface Products Gap Filler (2-Part), No Spacer Beads, Pot Life = 60m, 3.6 W/m-K Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 12
Mult.: 1

3500S35 / TGF 3600
Bergquist Company 2478317
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 2
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2482634
Bergquist Company Thermal Interface Products Gap Filler (2-Part), No Spacer Beads, Pot Life=60m, 3.6 W/m-K, Dual Cartridge Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 4
Mult.: 1

3500S35 / TGF 3600
Bergquist Company 2482756
Bergquist Company Thermal Interface Products Liqui-Bond EA 1805 Conductive, 2-Part, Liquid Epoxy Adhesive Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 1
Mult.: 1

EA 1805 / TLB EA1800
Bergquist Company 2498310
Bergquist Company Thermal Interface Products Gap Filler (2-Part), No Spacer Beads, Pot Life=60m, 3.6 W/m-K, Dual Cartridge Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 14
Mult.: 1

3500S35 / TGF 3600
Bergquist Company 2545874
Bergquist Company Thermal Interface Products Conductive, Liquid Gap Filler, Auto Component Products, Gap Filler TGF 1500/1500 Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

1500 / TGF 1500
Bergquist Company 2545888
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 4000 / 4000 Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 1
Mult.: 1

4000 / TGF 4000
Bergquist Company 2545908
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 4000 / 4000 Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 18
Mult.: 1

4000 / TGF 4000
Bergquist Company 2563270
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2590952
Bergquist Company Thermal Interface Products Gap Filler (2-Part), No Spacer Beads, Pot Life = 60m, 3.6 W/m-K Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 4
Mult.: 1

3500S35 / TGF 3600
Bergquist Company 2605454
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 2
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2605474
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 80
Mult.: 1

TLF 6000HG
Bergquist Company 2605486
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 2
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2624518
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 25
Mult.: 1

TLF 6000HG
Bergquist Company 2624538
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K, KG, Liqui-Form TLF 6000HG Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 829,188
Mult.: 1

TLF 6000HG
Bergquist Company 2624562
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 3
Mult.: 1

TLF 6000HG