Mga Data Center Application

Ang mga Bergquist Company Data Center Application ay nagtatampok ng mga advanced material na nakakatulong sa thermal management, long-term reliability, at stress protection. Nadaragdagan ang mga data center speed at volume habang nagiging popular ang analytics, artificial intelligence (AI), at high-performance computing. Dahil sa tumaas na demand na ito, nagiging mas mainit ang mga next-generation data center, at puwedeng makaapekto sa performance ang init na ito. Ang Bergquist Company ay nagdidisenyo at nagma-manufacture ng mga component-level na thermal management at stress protection product, na tumutulong para matugunan ang tumitinding mga performance requirement.

Mga Resulta: 211
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Uri Package / Case Materyal Thermal Conductivity Breakdown Voltage Kulay Minimum na Operating Temperature Maximum na Operating Temperature Haba Lapad Kapal Tensile Strength Rating ng Flammability Series Packaging
Bergquist Company 2624563
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 2,874
Mult.: 1

TLF 6000HG
Bergquist Company 2641227
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 2
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2641230
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 904
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2641232
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 904
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2682556
Bergquist Company Thermal Interface Products Liqui-Bond EA 1805 Conductive, 2-Part, Liquid Epoxy Adhesive Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 1
Mult.: 1

EA 1805 / TLB EA1800
Bergquist Company 2746202
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Lead-Time para sa Hindi Naka-stock 6 (na) Linggo
Min.: 11
Mult.: 1

4000 / TGF 4000
Bergquist Company 2763082
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 50
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2763089
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 3.8 W/m-K, Liqui-Form Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 50
Mult.: 1

TLF LF3800LVO / TLF 3800LVO
Bergquist Company 2763109
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2763110
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2796659
Bergquist Company Thermal Interface Products Conductive Gel Interface for Data/Telecom, 10 W/m-K, 1 Gallon Pail, Liqui-Form Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 25
Mult.: 1

TLF 10000