Mga Data Center Application

Ang mga Bergquist Company Data Center Application ay nagtatampok ng mga advanced material na nakakatulong sa thermal management, long-term reliability, at stress protection. Nadaragdagan ang mga data center speed at volume habang nagiging popular ang analytics, artificial intelligence (AI), at high-performance computing. Dahil sa tumaas na demand na ito, nagiging mas mainit ang mga next-generation data center, at puwedeng makaapekto sa performance ang init na ito. Ang Bergquist Company ay nagdidisenyo at nagma-manufacture ng mga component-level na thermal management at stress protection product, na tumutulong para matugunan ang tumitinding mga performance requirement.

Mga Resulta: 215
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Uri Package / Case Materyal Thermal Conductivity Breakdown Voltage Kulay Minimum na Operating Temperature Maximum na Operating Temperature Haba Lapad Kapal Tensile Strength Rating ng Flammability Series Packaging
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 1 Gallon, 6.0 W/m-K, Liqui-Form TLF 6000HG Lead-Time para sa Hindi Naka-stock 13 (na) Linggo
Min.: 1
Mult.: 1
Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG
Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM Lead-Time para sa Hindi Naka-stock 19 (na) Linggo
Min.: 438
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 1.016 mm 4 psi UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 180ml Cartridge, 6 W/m-K, Liqui-Form
Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 10
Mult.: 1

Thermal Interface Materials Thermally Conductive Liquid Formable Material TLF 6000HG
Bergquist Company Thermal Interface Products Liquid Gap Filler, 200CC Dual Cartridge, Gap Filler TGF 1500/1500, IDH 2233096 Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 11
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Non-standard Silicone Elastomer 1.8 W/m-K Yellow, White - 60 C + 200 C UL 94 V-0 1500 / TGF 1500
Bergquist Company Thermal Interface Products Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 11
Mult.: 1

Non-standard 300G / THF 1600G
Bergquist Company Thermal Interface Products Liquid Epoxy Adhesive, 2-Part, 200CC Dual Cartridge, Liqui-Bond TLBEA1800/EA1805 Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 1
Mult.: 1

Thermally Conductive Adhesives Thermal Conductive Gel Paste Epoxy 1.8 W/m-K Gray, Yellow - 40 C + 125 C 450 psi UL 94 V-0 EA 1805 / TLB EA1800
Bergquist Company Thermal Interface Products Liquid Silicon Adhesive, 1-Part, 50CC Dual Cartridge, LIQUI-BOND TLBSA3500 Lead-Time para sa Hindi Naka-stock 16 (na) Linggo
Min.: 10
Mult.: 1

Thermally Conductive Adhesives Silicone Elastomer Brown - 60 C + 200 C UL 94 V-0 SA 3505 / TLB SA3500
Bergquist Company Thermal Interface Products GAP PAD, 6W/m-K, 8" x 16" Sheet, 0.125" Thickness, TGP6000ULM, IDH 2214846 Lead-Time 8 (na) Linggo

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 6 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 3.175 mm 6 psi UL 94 V-0 TGP 6000ULM
Bergquist Company 2605474
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 80
Mult.: 1

TLF 6000HG
Bergquist Company TLF6000HG-00-00-8G FLEX
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 25
Mult.: 1

TLF 6000HG
Bergquist Company 2624538
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K, KG, Liqui-Form TLF 6000HG Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 833,334
Mult.: 1

TLF 6000HG
Bergquist Company TLF600HG00-00-300CC
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 3
Mult.: 1

TLF 6000HG
Bergquist Company TLF6000HG-00-00-300CC
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 2,871
Mult.: 1

TLF 6000HG
Bergquist Company 2763096
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 6.0 W/m-K, Liqui-Form TLF 6000HG Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 25
Mult.: 1

TLF 6000HG
Bergquist Company 2746333
Bergquist Company Thermal Interface Products GAP PAD, Conductive, Reinforced, Soft S-Class Gap Fill, 3.0 W/m-K Lead-Time para sa Hindi Naka-stock 15 (na) Linggo
Min.: 9
Mult.: 1

3000ULM / TGP 3000ULM