Mga Server Application

Ang mga Bergquist Company Server Application ay nagtatampok ng mga thermal management product na dinisenyo para gamitin sa maraming iba't ibang paraan — mula sa iilang server sa closet hanggang sa libu-libong server sa data center. Kahit ilan ang server, kapag nabawasan ng kahit konti ang init o nagbago ang performance ng component, malaki ang puwedeng maging epekto nito sa operasyon ng infrastructure. Nag-aalok ang Bergquist Company ng mga advanced material na magagamit sa buong circuit board, makakatulong ang mga ito na mapahusay ang performance at ang kaugnay na network.

Mga Resulta: 82
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Uri Package / Case Materyal Thermal Conductivity Breakdown Voltage Kulay Minimum na Operating Temperature Maximum na Operating Temperature Haba Lapad Kapal Tensile Strength Rating ng Flammability Series Packaging
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.140" Thickness Lead-Time para sa Hindi Naka-stock 11 (na) Linggo
Min.: 2
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 180ml Cartridge, 6 W/m-K, Liqui-Form
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 10
Mult.: 1

Thermal Interface Materials Thermally Conductive Liquid Formable Material TLF 6000HG
Bergquist Company Thermal Interface Products 1-Part, Liquid Formable Material, 150CC Cartridge, 3.5 W/m-K, Liqui-Form Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 16
Mult.: 1

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 3.5 W/m-K Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products 1-Part, Liquid Formable Material, 300CC Cartridge, 3.5 W/m-K, Liqui-Form Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Thermal Interface Materials Thermally Conductive Liquid Formable Material Silicone Elastomer Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products GAP PAD, 10W/m-K, 8" x 8" Sheet, 0.125" Thickness, TGP10000ULM, IDH 2599713 Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 10 W/m-K 3.2 kVAC Gray - 60 C + 200 C 203.2 mm 203.2 mm 3.175 mm 25 psi UL 94 V-0 TGP 10000ULM
Bergquist Company Thermal Interface Products GAP PAD, 6W/m-K, 8" x 16" Sheet, 0.125" Thickness, TGP6000ULM, IDH 2214846 Lead-Time para sa Hindi Naka-stock 6 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 6 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 3.175 mm 6 psi UL 94 V-0 TGP 6000ULM
Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM, L8INW16INH0.1 Hindi Naka-stock
Min.: 1
Mult.: 1
Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 2.54 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM Hindi Naka-stock
Min.: 5
Mult.: 1
Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Material, 150CC, 3.5 W/m-K, Liqui-Form Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 6
Mult.: 1
Thermal Interface Materials Liquid Form 3.5 W/m-K Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.040" Thickness Lead-Time para sa Hindi Naka-stock 28 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.060" Thickness Lead-Time para sa Hindi Naka-stock 28 (na) Linggo
Min.: 3
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.080" Thickness Lead-Time para sa Hindi Naka-stock 28 (na) Linggo
Min.: 3
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.100" Thickness Lead-Time para sa Hindi Naka-stock 28 (na) Linggo
Min.: 2
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.120" Thickness Lead-Time para sa Hindi Naka-stock 28 (na) Linggo
Min.: 2
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.160" Thickness Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 2
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, Ultra-Low Modulus, 8"x16" Sheet, 0.040" Thickness, 2 Side Tack Hindi Naka-stock
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 1.016 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products GAP PAD, 7W/m-K, Ultra-Low Modulus, GAP PAD TGP 7000ULM Hindi Naka-stock
Min.: 7
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 7 W/m-K 5 kVAC Gray - 60 C + 200 C 203.2 mm 203.2 mm 0.762 mm UL 94 V-0 TGP 7000ULM
Bergquist Company Thermal Interface Products Hindi Naka-stock
Min.: 11
Mult.: 1

Non-standard 300G / THF 1600G
Bergquist Company Thermal Interface Products 1-Part, Liquid Formable Material, 600CC Cartridge, 3.5 W/m-K, Liqui-Form Hindi Naka-stock
Min.: 3
Mult.: 1

Thermal Interface Materials Thermally Conductive Liquid Formable Material Silicone Elastomer Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.008" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.203 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.010" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.254 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.012" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 3.07 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Thermally Conductive Gel Interface Material, 10 W/m-K, 0.8 Gallon Pail Hindi Naka-stock
Min.: 25
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Gel Silicone Elastomer 10 W/m-K Red - 60 C + 200 C UL 94 V-0 TLF 10000
Bergquist Company Thermal Interface Products Thermally Conductive Gel for Data & Telecom Market, 10 W/m-K, 30CC Syringe Hindi Naka-stock
Min.: 50
Mult.: 1

TLF 10000
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 1 Gallon Pail, 6 W/m-K, Liqui-Form Hindi Naka-stock
Min.: 1
Mult.: 1

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG