NeXLev® High-Density Parallel B2B Connectors

Amphenol TCS NeXLev® High-Density Parallel B2B Connectors are capable of handling data rates up to 12.5Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance. The robust, damage-resistant design includes up to 57 real signals per linear centimeter (145 signals per linear inch), a ball grid array for precise alignment, a compliant BGA-style attachment to increase SMT process yields, and rugged wafer construction. The wafers can be routed to support either single-ended or differential-paired architectures.

Mga Resulta: 34
Pumili Larawan # ng Piyesa
 Mfr.
Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami.
Dami RoHS ECAD Model Produkto
Dami ng Posisyon
Pitch
Dami ng Row
Istilo ng Termination
Anggulo ng Mounting
Taas ng Stack
Rating ng Current
Rating ng Voltage
Maximum na Bilis ng Data
Minimum na Operating Temperature
Maximum na Operating Temperature
Plating ng Contact
Materyal ng Contact
Materyal ng Housing
Series
Packaging

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Datasheet
24May Stock
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 18 mm, 20 mm, 22 mm25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
20May Stock
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray

Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Plug Solder Balls
Datasheet
20May Stock
Min.: 20
Mult.: 20

Plugs 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Hindi Naka-stock
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Datasheet
Lead-Time para sa Hindi Naka-stock 26 (na) Linggo
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Hindi Naka-stock
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Hindi Naka-stock
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Datasheet
Hindi Naka-stock
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Hindi Naka-stock
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Datasheet
Hindi Naka-stock
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Bulk
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls
Datasheet
Hindi Naka-stock
Min.: 24
Mult.: 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Hindi Naka-stock
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
Hindi Naka-stock
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Hindi Naka-stock
Min.: 40
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
Hindi Naka-stock
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Hindi Naka-stock
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Hindi Naka-stock
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
Hindi Naka-stock
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder Balls
Datasheet
Hindi Naka-stock
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Datasheet
Hindi Naka-stock
Min.: 20
Mult.: 20

Receptacles 300 Position 1.15 mm (0.045 in) BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug 380 Solder Balls
Datasheet
Hindi Naka-stock
Min.: 96
Mult.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 13 mm, 18 mm, 23 mm, 26 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug Solder Balls
Datasheet
Hindi Naka-stock
Min.: 24
Mult.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 13 mm, 18 mm, 23 mm, 26 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug 380 Solder Balls
Datasheet
Hindi Naka-stock
Min.: 24
Mult.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug Solder Balls
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 24
Mult.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Plug 380 Solder Balls
Datasheet
Hindi Naka-stock
Min.: 24
Mult.: 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 14 mm, 17 mm, 22 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev