iW-RainboW-G40M i.MX 8M Plus Solderable LGA Module

iWave Global iW-RainboW-G40M i.MX 8M Plus Solderable LGA Module is a SoC-based module designed per the Open Standard Module™ specifications (OSM) on a 45mm2 Size-L form factor. The iW-RainboW-G40M integrates NXP’s i.MX 8M Plus offerings Quad/QuadLite/Dual Cortex A53 at up to 1.8GHz, NPU with up to 2.3 TOP/s, HDR-capable Image Signal Processor (ISP) with IEEE 802.11 a/b/g/n/ac/ax (ax is optional) Wi-Fi and BLUETOOTH® 5.0 module. The i.MX 8M Plus OSM LGA Module is aimed towards applications mainly focusing on Machine Learning, NPU/vision systems, advanced multimedia, and industrial automation with high reliability.

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Packaging
iWave Global System-On-Modules - SOM i.MX 8M Plus Quad OSM SOM with 2GB LPDDR4, 16GB eMMC, 802.11ac Wi-Fi + BLE 5.0
Datasheet
Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 1
Mult.: 1

iW-G40M 45 mm x 45 mm NXP i.MX 8M Plus Quad 2 GHz 8 GB 2 GB 4.75 V to 5.25 V CAN FD, Bluetooth, GPIO, HDMI, I2C, LVDS, MIPI-DSI, PCIe, RGMII, SAI/I2S, SDIO, SPI, UART, USB 2.0, USB 3.0, WiFi - 40 C + 85 C 45 mm x 45 mm x 1.2 mm Bulk
iWave Global System-On-Modules - SOM i.MX 8M Plus Quad OSM SOM with 4GB LPDDR4, 16GB eMMC, 802.11ac Wi-Fi + BLE 5.0
Datasheet
Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 1
Mult.: 1

iW-G40M 45 mm x 45 mm NXP i.MX 8M Plus Quad 2 GHz 8 GB 4 GB 4.75 V to 5.25 V CAN FD, Bluetooth, GPIO, HDMI, I2C, LVDS, MIPI-DSI, PCIe, RGMII, SAI/I2S, SDIO, SPI, UART, USB 2.0, USB 3.0, WiFi - 40 C + 85 C 45 mm x 45 mm x 1.2 mm Bulk