Minitek® Pwr 3.0 Higher Current Connectors

Amphenol FCI Minitek® Pwr 3.0 Higher Current Connectors (HCC) are designed for power-dense applications with current ratings up to 12.5A per contact. This connector series is available in a dual-row configuration with 2 to 24 circuits and is designed for Wire-to-Wire, Wire-to-Board, and Wire-to-Panel applications. Crimp, snap-in header, and receptacle contacts are used to terminate 20AWG to 16AWG wires.

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Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 04 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
250Inaasahan 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 06 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
200Inaasahan 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 10 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
140Inaasahan 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 12 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
130Inaasahan 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 14 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
110Inoorder
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 16 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
100Inaasahan 8/18/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 18 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
90Inoorder
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 20 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
80Inoorder
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 22 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
80Inoorder
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 12 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
150Inaasahan 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 14 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
130Inaasahan 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 16 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
120Inaasahan 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 18 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
110Inaasahan 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 20 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
100Inaasahan 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 22 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
90Inaasahan 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 24 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
80Inaasahan 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 14Pos
Datasheet
Lead-Time para sa Hindi Naka-stock 13 (na) Linggo
Min.: 6,000
Mult.: 6,000
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 18Pos
Datasheet
Lead-Time para sa Hindi Naka-stock 13 (na) Linggo
Min.: 6,000
Mult.: 6,000
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 20Pos
Datasheet
Lead-Time para sa Hindi Naka-stock 13 (na) Linggo
Min.: 6,000
Mult.: 6,000
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 22Pos
Datasheet
Lead-Time para sa Hindi Naka-stock 13 (na) Linggo
Min.: 6,000
Mult.: 6,000
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 24Pos
Datasheet
Lead-Time para sa Hindi Naka-stock 13 (na) Linggo
Min.: 6,000
Mult.: 500
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR RATH HDR 2Pos G/F
Datasheet
Lead-Time para sa Hindi Naka-stock 13 (na) Linggo
Min.: 9,842
Mult.: 9,842
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR RATH HDR 2Pos Tin
Datasheet
Lead-Time para sa Hindi Naka-stock 13 (na) Linggo
Min.: 1
Mult.: 1
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR RATH HDR 4Pos G/F
Datasheet
Lead-Time para sa Hindi Naka-stock 13 (na) Linggo
Min.: 6,188
Mult.: 6,188
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR RATH HDR 6Pos G/F
Datasheet
Lead-Time para sa Hindi Naka-stock 13 (na) Linggo
Min.: 4,522
Mult.: 4,522