TLV493DA1B6MS2GOTOBO1

Infineon Technologies
726-TLV493DA1B63DMS2
TLV493DA1B6MS2GOTOBO1

Mfr.:

Paglalarawan:
Magnetic Sensor Development Tools POSITION SENS CONS & IND

Datasheet:
Higit Pang Impormasyon
Alamin pa ang tungkol sa Infineon Technologies TLV493DA1B6MS2GOTOBO1

May Stock: 2

Stock:
2
Maaaring Ipadala Agad
Inoorder:
11
Inaasahan 7/16/2026
11
Inaasahan 8/6/2026
Lead-Time ng Pabrika:
53
(na) Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.
Matagal na lead time na iniulat sa produktong ito.
Minimum: 1   Mga Multiple: 1
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:
LIBRENG Ipapadala ang Produktong Ito

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱2,295.72 ₱2,295.72

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Infineon
Kategorya ng Produkto: Mga Tool sa Pag-develop ng Magnetic Sensor
RoHS:  
Evaluation Kits
3D Magnetic Sensor
TLV493D-A1B6
5 V
Bulk
Brand: Infineon Technologies
Mga Dimensiyon: 50 mm x 14 mm
Uri ng Produkto: Magnetic Sensor Development Tools
Dami ng Pack ng Pabrika: 1
Subcategory: Development Tools
Mga Alias ng # ng Piyesa : SP001707574 TLV493D-A1B6 3D-MS2GO
Timbang ng Unit: 23.375 g
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Mga Piniling Attribute: 0

Datasheet

Product Catalogs

Technical Resources

Mga Kodigo sa Pagsunod
CNHTS:
8543709990
CAHTS:
8543700000
USHTS:
8543709860
JPHTS:
854370000
ECCN:
EAR99
Mga Klasipikasyon ng Pinagmulan
Bansang Pinagmulan:
Germany
Bansang Pinagmulan ng Pag-assemble:
Romania
Bansa ng Diffusion:
Romania
Ang bansa ay maaaring magbago sa oras ng pagpapadala.

XENSIV™ Sensor 2GO Kits

Infineon XENSIV™ Sensor 2GO Kits are evaluation boards that are equipped with a sensor and combined with an ARM® Cortex®-M0 CPU. The sensor 2GO kits provide a complete set of onboard devices, including an onboard debugger. Build applications and gadgets with these ready-to-use plug-and-play boards.

3D-MS2GO Evaluation Boards

Infineon Technologies 3D-MS2GO Evaluation Boards are equipped with a magnetic sensor for three-dimensional measurement combined with an ARM® Cortex™-M0 CPU. The 3D Magnetic Sensor 2GO includes a complete set of on-board devices, including an on-board debugger. Build an application and gadget with the 3D Magnetic Sensor 2GO. The TLE493D-W2B6 3D-MS2GO includes the TLE493D-W2B6 three dimensional magnetic sensor. The TLE493D-A2B6 3D-MS2GO includes the TLE493D-A2B6 three-dimensional magnetic sensor. Speed up evaluation time with Infineon's add-on components for 3D magnetic sensor 2GO kits.

TLV493D-A1B6 MS2GO

Infineon Technologies TLV493D-A1B6 MS2GO Evaluation Board is equipped with a magnetic sensor for three-dimensional measurement. This, combined with an ARM® Cortex™-M0 CPU, makes the 3D Magnetic Sensor 2GO a complete set of onboard devices, including an onboard debugger.

Shield2GO Boards

Infineon Technologies Shield2GO Boards all feature one Infineon IC in a standardized form factor and pin layout for fast orientation. The boards have solderless connectors that allow for stacking the boards instead of soldering. This makes the Infineon Technologies Shield2GO boards simple, reusable, and flexible.

Development Tools

Infineon Development Tools offer a wide selection to enable the engineer's unique design, regardless of the target application. These range from LED lighting, power management, sensors, analog & digital ICs, communication, optoelectronic, and embedded development tools.

Sensor Solutions

Infineon Technologies Sensor Solutions make life smarter, safer, and greener with a broad range of sensors for automotive, industrial, and home applications. Infineon sensors are exceptionally precise, thanks to industry-leading technologies. These devices are ideal for a wide range of applications in the automotive, industrial, and consumer markets. Infineon Technologies is strengthening its market position by acquiring ams OSRAM’s non-optical analog and mixed-signal sensor portfolio to expand its XENSIV™ solutions. This integration enhances capabilities in the medical, automotive, and industrial robotics sectors, supporting advancements in software-defined vehicles and physical AI.

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