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Dami RoHS ECAD Model Produkto
Package / Case
Materyal
Thermal Conductivity
Breakdown Voltage
Kulay
Minimum na Operating Temperature
Maximum na Operating Temperature
Kapal
Tensile Strength
Rating ng Flammability
Series
Bergquist Company Thermal Interface Products Silicone, for High Humidity/High Dielectric, 2.2W/m-K, Sil-Pad TSP2200/1750
Datasheet
Hindi Naka-stock
Min.: 10
Mult.: 10
Gap Fillers / Gap Pads / Sheets Non-standard Silicone 2.2 W/m-K 6 kVAC Green - 60 C + 180 C 0.305 mm 10 MPa UL 94 V-0 1750 / TSP 2200
Bergquist Company Thermal Interface Products Silicone, for High Humidity/High Dielectric, 2.2W/m-K, Sil-Pad TSP2200/1750
Datasheet
Hindi Naka-stock
Min.: 10
Mult.: 1
Gap Fillers / Gap Pads / Sheets Non-standard Silicone 2.2 W/m-K 6 kVAC Green - 60 C + 180 C 0.305 mm 10 MPa UL 94 V-0 1750 / TSP 2200