200-LPAM Mga Board to Board at Mezzanine Connector

Mga Resulta: 113
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Dami ng Posisyon Pitch Dami ng Row Istilo ng Termination Anggulo ng Mounting Taas ng Stack Rating ng Current Rating ng Voltage Maximum na Bilis ng Data Minimum na Operating Temperature Maximum na Operating Temperature Plating ng Contact Materyal ng Contact Materyal ng Housing Series Packaging
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 2 (na) Linggo
Min.: 300
Mult.: 300
Reel: 300

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 6 (na) Linggo
Min.: 300
Mult.: 300
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 1
Mult.: 1
Reel: 375

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 300
Mult.: 300
Reel: 300
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 475
Mult.: 475
Reel: 475
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 325
Mult.: 325
Reel: 325

Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 475
Mult.: 475
Reel: 475

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 325
Mult.: 325
Reel: 325

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 6 (na) Linggo
Min.: 300
Mult.: 300
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 375
Mult.: 375
Reel: 375
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 2 (na) Linggo
Min.: 300
Mult.: 300
Reel: 300
Hindi
LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 575
Mult.: 575
Reel: 575
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 300
Mult.: 300
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 400
Mult.: 400
Reel: 400

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 575
Mult.: 575
Reel: 575

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 11 (na) Linggo
Min.: 450
Mult.: 450
Reel: 450

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 2 (na) Linggo
Min.: 300
Mult.: 300
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 575
Mult.: 575
Reel: 575

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1
Reel: 325
Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 300
Mult.: 300
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 300
Mult.: 300
Reel: 300
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 450
Mult.: 450
Reel: 450
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 1
Mult.: 1
Reel: 400

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 300
Mult.: 300
Reel: 300

LPAM Reel