Samtec APM6 Serye Mga Board to Board at Mezzanine Connector

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Dami RoHS ECAD Model Produkto
Dami ng Posisyon
Pitch
Dami ng Row
Istilo ng Termination
Anggulo ng Mounting
Taas ng Stack
Rating ng Current
Rating ng Voltage
Maximum na Bilis ng Data
Minimum na Operating Temperature
Maximum na Operating Temperature
Plating ng Contact
Materyal ng Contact
Materyal ng Housing
Series
Packaging
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 475
Mult.: 475
Reel: 475
Plugs 400 Position 0.635 mm (0.025 in) 4 Row Straight 5 mm 1.2 A 150 VAC, 212 VDC 112 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 475
Mult.: 475
Reel: 475
Plugs 400 Position 0.635 mm (0.025 in) 4 Row Straight 5 mm 1.2 A 150 VAC, 212 VDC 112 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 475
Mult.: 475
Reel: 475
Plugs 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.2 A 150 VAC, 212 VDC 112 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 475
Mult.: 475
Reel: 475

Headers 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 1 Linggo
Min.: 475
Mult.: 475
Reel: 475

Headers 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 2 (na) Linggo
Min.: 175
Mult.: 175
Reel: 175
APM6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 2 (na) Linggo
Min.: 175
Mult.: 175
Reel: 175

Headers 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 2 (na) Linggo
Min.: 175
Mult.: 175
Reel: 175
Plugs 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.2 A 150 VAC, 212 VDC 112 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 1 Linggo
Min.: 175
Mult.: 175
Reel: 175

Headers 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 1 Linggo
Min.: 175
Mult.: 175
Reel: 175

Headers 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 1 Linggo
Min.: 475
Mult.: 475
Reel: 475

Headers 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 175
Mult.: 175
Reel: 175
APM6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 1 Linggo
Min.: 600
Mult.: 600
Reel: 600

Headers 80 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
Datasheet
Lead-Time para sa Hindi Naka-stock 2 (na) Linggo
Min.: 175
Mult.: 175
Reel: 175

Headers 160 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel