C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.

Mga Resulta: 485
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Uri Dami ng Posisyon Pitch Dami ng Row Agwat ng Row Isitilo ng Mounting Istilo ng Termination Anggulo ng Mounting Gender ng Contact Plating ng Contact Haba ng Mating Post Termination Post Length Series Pangalang pangkalakal Application Gauge ng Wire Minimum na Operating Temperature Maximum na Operating Temperature Packaging
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Tn-A 15Ckt Hindi Naka-stock
Min.: 2,700
Mult.: 900

Headers Breakaway 15 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Tn-A 16Ckt Hindi Naka-stock
Min.: 2,700
Mult.: 900

Headers Breakaway 16 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Tn-A 17Ckt Hindi Naka-stock
Min.: 2,700
Mult.: 900

Headers Breakaway 17 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Tn-A 20Ckt Hindi Naka-stock
Min.: 2,880
Mult.: 720

Headers Breakaway 20 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Tn-A 24Ckt Hindi Naka-stock
Min.: 2,880
Mult.: 720

Headers Breakaway 24 Position 2.54 mm (0.1 in) 1 Row Solder Pin Right Angle Tin 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Tn-A 25Ckt Hindi Naka-stock
Min.: 2,880
Mult.: 720

Headers Breakaway 25 Position 2.54 mm (0.1 in) 1 Row Solder Pin Right Angle Tin 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Tn-A 28Ckt Hindi Naka-stock
Min.: 2,700
Mult.: 450

Headers Breakaway 28 Position 2.54 mm (0.1 in) 1 Row Solder Pin Right Angle Tin 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Tn-A 30Ckt Hindi Naka-stock
Min.: 2,700
Mult.: 450

Headers Breakaway 30 Position 2.54 mm (0.1 in) 1 Row Solder Pin Right Angle Tin 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Tn-A 31Ckt Hindi Naka-stock
Min.: 2,700
Mult.: 450

Headers Breakaway 31 Position 2.54 mm (0.1 in) 1 Row Solder Pin Right Angle Tin 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 11P R/A SR SEL AU Hindi Naka-stock
Min.: 2,700
Mult.: 900

Headers Breakaway 11 Position 2.54 mm (0.1 in) 1 Row Solder Pin Right Angle Gold 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Au-E 14Ck Hindi Naka-stock
Min.: 2,700
Mult.: 900

Headers Breakaway 14 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 90121 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Au-E 15Ckt Hindi Naka-stock
Min.: 2,700
Mult.: 900

Headers Breakaway 15 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Au-E 24Ckt Lead-Time para sa Hindi Naka-stock 14 (na) Linggo
Min.: 2,880
Mult.: 720

Headers Breakaway 24 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 90121 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 40P R/A SR SEL AU Hindi Naka-stock
Min.: 2,700
Mult.: 450

Headers Breakaway 40 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 .75/2.90mm Au-F 2Ckt Hindi Naka-stock
Min.: 3,000
Mult.: 3,000

Headers Breakaway 2 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 .75/2.90mm Au-F 3Ckt Hindi Naka-stock
Min.: 3,000
Mult.: 3,000

Headers Breakaway 3 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 .75/2.90mm Au-F 4Ckt Hindi Naka-stock
Min.: 3,000
Mult.: 3,000

Headers Breakaway 4 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 .75/2.90mm Au-F 8Ckt Hindi Naka-stock
Min.: 2,400
Mult.: 1,200

Headers Breakaway 8 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Au-F 12Ckt Hindi Naka-stock
Min.: 2,700
Mult.: 900

Headers Breakaway 12 Position 2.54 mm (0.1 in) 1 Row Solder Pin Right Angle Gold 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Au-F 14Ckt Hindi Naka-stock
Min.: 2,700
Mult.: 900

Headers Breakaway 14 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Au-F 15Ckt Hindi Naka-stock
Min.: 900
Mult.: 900

Headers Breakaway 15 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid SR RA Pn 6.75 75/2.90mm Au-F 40Ckt Hindi Naka-stock
Min.: 2,700
Mult.: 450

Headers Breakaway 40 Position 2.54 mm (0.1 in) 1 Row Solder Pin Right Angle Gold 90121 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 18P R/A DR TIN Hindi Naka-stock
Min.: 3,000
Mult.: 600

Headers Breakaway 18 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90122 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 30P R/A DR TIN Hindi Naka-stock
Min.: 3,000
Mult.: 300

Headers Breakaway 30 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90122 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 50P R/A DR TIN Hindi Naka-stock
Min.: 3,000
Mult.: 300

Headers Breakaway 50 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90122 C-Grid - 55 C + 125 C Tray