C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.

Mga Resulta: 485
Pumili Larawan # ng Piyesa
 Mfr.
Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami.
Dami RoHS ECAD Model Produkto
Uri
Dami ng Posisyon
Pitch
Dami ng Row
Agwat ng Row
Isitilo ng Mounting
Istilo ng Termination
Anggulo ng Mounting
Gender ng Contact
Plating ng Contact
Haba ng Mating Post
Termination Post Length
Series
Pangalang pangkalakal
Application
Gauge ng Wire
Minimum na Operating Temperature
Maximum na Operating Temperature
Packaging
Molex Headers & Wire Housings C-Grid PCB Conn DR H n DR Horz Au-F 16Ckt
Datasheet
Hindi Naka-stock
Min.: 2,700
Mult.: 675

Headers Socket 16 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Socket (Female) Gold 2.9 mm (0.114 in) 90152 C-Grid - 55 C + 125 C Tube
Molex Headers & Wire Housings C-GRID PCB CONN DR 20P HORZ A
Datasheet
Hindi Naka-stock
Min.: 3,432
Mult.: 1,716

Headers Socket 20 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Socket (Female) Gold 2.9 mm (0.114 in) 90152 C-Grid - 55 C + 125 C Tube
Molex Headers & Wire Housings C-Grid PCB Conn DR H n DR Horz Au-F 50Ckt
Datasheet
Hindi Naka-stock
Min.: 3,120
Mult.: 624

Headers Socket Assembly 50 Position 2.54 mm (0.1 in) 2 Row Solder Pin Right Angle Gold 90152 C-Grid - 55 C + 125 C Tube
Molex Headers & Wire Housings C-Grid PCB Conn DR H n DR Horz Au-F 60Ckt
Datasheet
Hindi Naka-stock
Min.: 2,730
Mult.: 546

Headers Socket 60 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Socket (Female) Gold 2.9 mm (0.114 in) 90152 C-Grid - 55 C + 125 C Tube
Molex Headers & Wire Housings C-Grid PCB Conn DR H n DR Horz Au-F 64Ckt
Datasheet
Hindi Naka-stock
Min.: 3,120
Mult.: 390

Headers Socket Assembly 64 Position 2.54 mm (0.1 in) 2 Row Solder Pin Right Angle Gold 90152 C-Grid - 55 C + 125 C Tube
Molex Headers & Wire Housings C-Grid Crp Conn Hsg Hsg SR FL Polz 30Ckt
Datasheet
Hindi Naka-stock
Min.: 2,400
Mult.: 1,200

Wire Housings Receptacle Housing 30 Position 2.54 mm (0.1 in) 1 Row Cable Mount / Free Hanging Crimp Socket (Female) 90156 C-Grid - 55 C + 105 C Bulk
Molex Headers & Wire Housings C-Grid Crp Conn Hsg Hsg DR FL Polz 64Ckt
Datasheet
Hindi Naka-stock
Min.: 2,400
Mult.: 1,200

Wire Housings Receptacle Housing 64 Position 2.54 mm (0.1 in) 2 Row Cable Mount / Free Hanging Crimp Socket (Female) 90160 C-Grid - 55 C + 105 C Bulk
Molex Headers & Wire Housings HEADER SHROUD CGRI D III R/A HI TEMP10P
Datasheet
Hindi Naka-stock
Min.: 3,360
Mult.: 1,680

Headers Shrouded 10 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 91814 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings HEADER SHROUD CGRI D III R/A HI TEMP 8P
Datasheet
Hindi Naka-stock
Min.: 2,080
Mult.: 2,080

Headers Shrouded 8 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.35 mm (0.25 in) 2.1 mm (0.083 in) 91814 C-Grid - 55 C + 125 C Tray
Molex 90130-8311
Molex Headers & Wire Housings HEADER SHROUD CGRI D III 10 CKT VOIDED
Datasheet
Hindi Naka-stock
Min.: 3,360
Mult.: 1,680

Headers Shrouded 90130 C-Grid