56Gbps NRZ High-Speed Board-To-Board Connectors

Samtec 56Gbps Non-Return-to-Zero (NRZ) High-Speed Board-To-Board Connectors majorly include NovaRay® Extreme Performance (EP) and AcceleRate® High-Performance (HP) Arrays connector systems. These connectors are 0.80mm (0.0315") and 0.635mm (0.025") pitch solutions, rated for 56Gbps NRZ applications. The 56Gbps NRZ method is a binary code using low and high signal levels to represent 1/0 information of the digital logic signal. The NRZ system can only transmit 1-bit, such as 0 or 1, of information per signal symbol period. These connectors are well-suited for high-speed applications, including 5G networking, industrial, military/aerospace, test connectivity, medical, broadcast video, automotive, AI/machine learning, and instrumentation.

Mga Resulta: 200
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Dami ng Posisyon Pitch Dami ng Row Istilo ng Termination Anggulo ng Mounting Taas ng Stack Rating ng Current Rating ng Voltage Maximum na Bilis ng Data Minimum na Operating Temperature Maximum na Operating Temperature Plating ng Contact Materyal ng Contact Materyal ng Housing Series Packaging
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 160 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 1 Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 160 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 7 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 160 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 160 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 160 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 1 Linggo
Min.: 500
Mult.: 500
Reel: 500
APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 1 Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate HP Vertical, High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 9 (na) Linggo
Min.: 325
Mult.: 325
Reel: 325

Connectors 100 Position 0.635 mm (0.025 in) 8 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate HP Vertical, High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 325
Mult.: 325
Reel: 325

Connectors 100 Position 0.635 mm (0.025 in) 8 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 1 Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 7 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 6 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 100 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Lead-Time para sa Hindi Naka-stock 1 Linggo
Min.: 500
Mult.: 500
Reel: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel