Express-SL-i5-6442EQ

ADLINK Technology
976-EXP-SL-I5-6442EQ
Express-SL-i5-6442EQ

Mfr.:

Paglalarawan:
Computer-On-Modules - COM Express-SL-i5-6442EQBasic COM Express Type6 module with 6 Intel Core i5-6442EQ processor at 1.9/2.7GHz with QM170 chipset

Datasheet:
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Availability

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Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱58,614.80 ₱58,614.80
₱56,803.42 ₱568,034.20
25 Quote

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
ADLINK Technology
Kategorya ng Produkto: Mga Computer-On-Module - COM
RoHS:  
COM Express Basic Type 6
Intel
Core i5-6442EQ
QM170
1.9 GHz, 2.7 GHz
32 GB
0 GB
6 MB
8.5 V to 20 V
- 40 C
+ 85 C
125 mm x 95 mm
Brand: ADLINK Technology
Paglalarawan/Function: Basis COM express type 6 module
Laki ng Memory: 32 GB
Uri ng Memory: DDR4-1867/2133
Pagkonsumo ng Power: 25 W
Uri ng Produkto: Computer-On-Modules - COM
Series: Express-SL
Dami ng Pack ng Pabrika: 1
Subcategory: Computing
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Mga Piniling Attribute: 0

Datasheet

PCN

CNHTS:
8543709990
USHTS:
8471500150
TARIC:
8471500000
MXHTS:
84715001
ECCN:
EAR99

Express-SL/SLE COM

ADLINK Express-SL/SLE is a COM.0 R2.1 Basic Size Type 6 computer-on-module supporting the 64-bit 6th Generation Intel® Core™, Xeon® E3, and Celeron® processors (formerly "Skylake-H") with Intel® QM170, HM170, CM236 Chipset. The Express-SL/SLE provides outstanding, high-performance graphics processing, reduced development time, and long-lifecycle support. The device features Intel Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR4 dual-channel memory at 1866/2133MHz with ECC/non-ECC support determined by CPU/chipset combination. This combination ensures the excellent overall performance of the module. High-speed connectivity of the CPU to the Intel QM170, HM170, CM236 Chipset is supported through an Intel Flexible Display Interface and Direct Media Interface.

COM Express Modules

ADLINK Technology has announced COM Express computer-on-modules (COMs) based on the 6th generation Intel Core i7/i5/i3 processors and latest Xeon processors. These modules follow the form, fit, function design principle for optimum flexibility in upgrading and application scalability, enabling accelerated development and faster time-to-market for embedded applications.

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