ADLINK Technology Mga Module ng Memory Module at Memory Card

Memory Cards cPCI-6636SL/6100E/M0-46U 4HP cPCI-6636 with dual-core Intel Skylake Core i3-6100E processor, 4GB DDR4-2133 SODIMM ECC memory, with GbE x2, COM x1, DVI-I x1, USB 3.0 x3, 2.5" SATA and CFAST; with J1, J2, J3, J5

Memory Cards 6U 4HP cPCI-6636SL with quad-core Intel Core i7-6820EQ processor, 4GB DDR4-2133 SODIMM, 2x GbE, COM, DVI-I,,3x USB 3.0, 2.5" SATA and CFast; with J1, J2, J3, J5

Memory Modules DDR2 PC2-5300, 512MB, 64Mx64, SO-DIMM 200P, 1.8V, Rank:1, CL5, Non-ECC, OP Temp:0 85, Fix Die:No(M-die), Micron M-die

Memory Modules DDR3-1333, 4GB, 512Mx72, VLP RDIMM 244P, 1.5V, Rank:1, CL9, ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(512Mx8)

Memory Modules DDR3-1333, 2GB, 256Mx64, SO-DIMM 204P, 1.5V, Rank:1, CL9, Non-ECC, OP Temp:0-85, Fix Die:Yes(F-die), Samsung Chip(256Mx8)

Memory Modules DDR3-1333, 4GB, 512Mx72, SO-DIMM 204P, 1.5V, Rank:2, CL9, ECC, OP Temp:0 85, Fix Die:No, Samsung Chip(256Mx8)

Memory Modules DDR3-1600, 4GB, 512Mx64, UDIMM 240P, 1.5V, Rank:1, CL11, Non-ECC, OP Temp:0-85, Fix Die:No(E-die), Samsung Chip(512Mx8)

Memory Modules DDR3L-1333, 2GB, 256Mx64, SO-DIMM 204P, 1.35V, Rank:1, CL9, Non-ECC, OP Temp:0 85, Fix Die:Yes(F-die), Samsung Chip(256Mx8), SPD Write-Protection

Memory Modules DDR3L-1333, 4GB, 512Mx64, SO-DIMM 204P, 1.35V, Rank:2, CL9, Non-ECC, OP Temp:0 85, Fix Die:No, Samsung Chip(256Mx8)

Memory Modules DDR3L-1600, 4GB, 512Mx64, SO-DIMM 204P, 1.35V, Rank:1, CL11, Non-ECC, OP Temp:-40-85, Fix Die:No, Micron Chip(512Mx8)

Memory Modules DDR3-1600, 2GB, 256Mx64, SO-DIMM 204P, 1.35V, Rank:1, CL11, Non-ECC, OP Temp:0-85, Fix Die:No, NTC-J Chip(256Mx8x8), Height:30.0mm

Memory Modules DDR3L PC3-12800, 2GB, 256Mx64, SO-DIMM 204P, 1.35V, Rank:1, CL11, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(256Mx16)