SPI Mga Module ng Multiprotocol

Mga Resulta: 4
Pumili Larawan # ng Piyesa
 Mfr.
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Dami RoHS ECAD Model Frequency
Output Power
Uri ng Interface
Supply Voltage - Min
Supply Voltage - Max
Minimum na Operating Temperature
Maximum na Operating Temperature
Mga Dimensiyon
Protocol - Bluetooth, BLE - 802.15.1
Packaging
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module, Chip Antenna
Datasheet
Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 144
Mult.: 144

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module, Chip Antenna
Datasheet
Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Reel
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module,u.FL Antenna
Datasheet
Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 144
Mult.: 144

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module,u.FL Antenna
Datasheet
Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 500
Mult.: 500
Reel: 500

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Reel