- 20 C Mga Module ng Multiprotocol

Mga Resulta: 86
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 Mfr.
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Dami RoHS ECAD Model Series
Frequency
Output Power
Uri ng Interface
Supply Voltage - Min
Supply Voltage - Max
Minimum na Operating Temperature
Maximum na Operating Temperature
Uri ng Antenna Connector
Mga Dimensiyon
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - Sub GHz
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Packaging
Amphenol-SAA Multiprotocol Modules UWB Tag U201C Hindi Naka-stock
Min.: 2,400
Mult.: 1
- 20 C + 85 C BLE 5.1 802.15.4z
Amphenol-SAA Multiprotocol Modules UWB Anchor U202C Hindi Naka-stock
Min.: 3,000
Mult.: 1
- 20 C + 85 C BLE 5.1 802.15.4z Reel
Texas Instruments Multiprotocol Modules TI WiLink8 SGL-Band Combo Mod A 595-WL18 A 595-WL1801MODGBMOCT
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 1,200
Mult.: 1,200
: 1,200

WL1801MOD 2.4 GHz - 20 C + 70 C BLE, Bluetooth 5.1 802.11 b/g/n Reel
Texas Instruments Multiprotocol Modules TI WiLink8 SGL-Band Combo Mod A 595-WL18 A 595-WL1805MODGBMOCT
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 1,200
Mult.: 1,200
: 1,200

WL1805MOD 2.4 GHz - 20 C + 70 C BLE, Bluetooth 5.1 802.11 b/g/n Reel
Texas Instruments Multiprotocol Modules TI WiLink8 SGL-Band Combo Mod A 595-WL18 A 595-WL1805MODGBMOCR
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 250
Mult.: 250
: 250

WL1805MOD 2.4 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 20 C + 70 C RF 13.4 mm x 13.3 mm x 2 mm BLE, Bluetooth 5.1 802.11 b/g/n Reel
Silex Technology Multiprotocol Modules [Sample Pack] SX-PCEAX-HMC-SP is a sample pack SKU ideal for small quantities used for evaluation and small pilot builds. SX-PCEAX-HMC-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in a half-height Mini P
Datasheet
Lead-Time para sa Hindi Naka-stock 40 (na) Linggo
Min.: 1
Mult.: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 29.85 mm x 26.65 mm x 2.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Silex Technology Multiprotocol Modules [Bulk SKU] SX-PCEAX-M2 is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 Card Type 2230-S3-A-E form factor. It is based on Qualcomm's QCA2066 chipset.
Datasheet
Lead-Time para sa Hindi Naka-stock 40 (na) Linggo
Min.: 100
Mult.: 100

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe 3.3 V 3.3 V - 20 C + 65 C 22 mm x 30 mm x 2.7 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Tray
Silex Technology Multiprotocol Modules [Bulk SKU] SX-PCEAX-SMT is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount form factor. It is based on Qualcomm's QCA2066 chipset.
Datasheet
Lead-Time para sa Hindi Naka-stock 40 (na) Linggo
Min.: 1,200
Mult.: 1,200
: 1,200

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe 3.3 V 3.3 V - 20 C + 65 C 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Reel
Silex Technology Multiprotocol Modules 802.11a/b/g/n/ac WLAN + BLE 4.2 SDIO
Datasheet
Lead-Time para sa Hindi Naka-stock 30 (na) Linggo
Min.: 500
Mult.: 500
: 500
2.402 GHz to 2.48 GHz, 5.18 GHz to 5.825 GHz UART 3.3 V 3.3 V - 20 C + 85 C u.FL 17 mm x 18 mm x 2.6 mm BLE, Bluetooth 802.11 a/b/g/n/ac Reel
Silex Technology Multiprotocol Modules 802.11a/b/g/n/ac WLAN + BLE 4.2 SDIO
Datasheet
Lead-Time para sa Hindi Naka-stock 30 (na) Linggo
Min.: 500
Mult.: 500
: 500

2.402 GHz to 2.48 GHz, 5.18 GHz to 5.825 GHz UART 3.3 V 3.3 V - 20 C + 85 C u.FL 17 mm x 18 mm x 2.6 mm BLE, Bluetooth 802.11 a/b/g/n/ac Reel
Silex Technology Multiprotocol Modules SMPL 802.11a/b/g/nac WLAN + BLE 4.2 SDIO
Datasheet
Lead-Time para sa Hindi Naka-stock 30 (na) Linggo
Min.: 1
Mult.: 1
2.402 GHz to 2.48 GHz, 5.18 GHz to 5.825 GHz UART 3.3 V 3.3 V - 20 C + 85 C u.FL 17 mm x 18 mm x 2.6 mm BLE, Bluetooth 802.11 a/b/g/n/ac Cut Tape
Silex Technology Multiprotocol Modules 802.11a/b/g/n/ac SDIO SiP 2.4/5 GHz
Datasheet
Lead-Time para sa Hindi Naka-stock 34 (na) Linggo
Min.: 3,000
Mult.: 3,000
: 3,000

SX-SDPAC 2.4 GHz, 5 GHz SDIO, UART 3.3 V 3.3 V - 20 C + 70 C 6.9 mm x 6.9 mm x 1.082 mm Bluetooth 802.11 a/b/g/n/ac Reel
Silex Technology Multiprotocol Modules 802.11a/b/g/n/ac SDIO SiP 2.4/5 GHz
Datasheet
Lead-Time para sa Hindi Naka-stock 34 (na) Linggo
Min.: 1
Mult.: 1

SX-SDPAC 2.4 GHz, 5 GHz SDIO, UART 3.135 V 3.465 V - 20 C + 80 C u.FL 6.9 mm x 6.9 mm x 1.082 mm Bluetooth 5.0 802.11 a/b/g/n/ac Cut Tape
Silex Technology Multiprotocol Modules Surface Mount
Datasheet
Lead-Time para sa Hindi Naka-stock 30 (na) Linggo
Min.: 500
Mult.: 500
: 500

SX-USBAC 2.4 GHz, 5 GHz USB 3.3 V 3.3 V - 20 C + 85 C On Board 22 mm x 21 mm x 2.75 mm Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Silex Technology Multiprotocol Modules Surface Mount Sample Piece
Datasheet
Lead-Time para sa Hindi Naka-stock 30 (na) Linggo
Min.: 1
Mult.: 1

SX-USBAC 2.4 GHz, 5 GHz USB 3.135 V 3.465 V - 20 C + 85 C MHF1 22 mm x 21 mm x 2.75 mm 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac Cut Tape
Silex Technology Multiprotocol Modules Type A USB Connector
Datasheet
Lead-Time para sa Hindi Naka-stock 32 (na) Linggo
Min.: 100
Mult.: 100

SX-USBAC 2.4 GHz, 5 GHz USB 3.3 V 3.3 V - 20 C + 85 C MHF1 52 mm x 22 mm x 2.75 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Quectel Multiprotocol Modules Wi-Fi 5, 802.11a/ b/ g/ n/ ac, 1 1, 2.4/ 5 GHz dual-band, Bluetooth 5.2, SDIO+UART
Datasheet
Lead-Time para sa Hindi Naka-stock 12 (na) Linggo
Min.: 250
Mult.: 250
: 250
2.4 GHz, 5 GHz SDIO, UART - 20 C + 70 C 12 mm x 12 mm x 1.55 mm BLE 5.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 1
Mult.: 1
PCIe - 20 C + 70 C 15 mm x 13 mm x 2.2 mm BLE 5.2 802.11 a/b/g/n/ac/ax
Quectel Multiprotocol Modules Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 1
Mult.: 1
PCIe - 20 C + 70 C 15 mm x 13 mm x 2.2 mm BLE 5.2 802.11 a/b/g/n/ac/ax
Quectel Multiprotocol Modules Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz PCM, SDIO, UART 3.1 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2.3 mm Bluetooth 5.0 802.11 a/b/g/n/ac
Quectel Multiprotocol Modules Wi-Fi 5 & Bluetooth 5.0, 2x antenna, -20 C to +70 C
Datasheet
Lead-Time para sa Hindi Naka-stock 12 (na) Linggo
Min.: 1,000
Mult.: 1,000
: 1,000

2.4 GHz, 5 GHz PCM, SDIO, UART 3.1 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2.3 mm Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz PCM, SDIO, UART 3.1 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2.3 mm Bluetooth 5.0 802.11 a/b/g/n/ac
Quectel Multiprotocol Modules Wi-Fi 5 & Bluetooth 5.0, 3x antenna, -20 C to +70 C
Datasheet
Lead-Time para sa Hindi Naka-stock 12 (na) Linggo
Min.: 1,000
Mult.: 1,000
: 1,000

2.4 GHz, 5 GHz PCM, SDIO, UART 3.1 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2.3 mm Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 1
Mult.: 1
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax
Quectel Multiprotocol Modules Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 1
Mult.: 1
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax