CYT3DLABABQ1AESGS

Infineon Technologies
726-CYT3DLABABQ1AESG
CYT3DLABABQ1AESGS

Mfr.:

Paglalarawan:
ARM Microcontrollers - MCU TRAVEO-2 CLUST.2.5DGRAPH

Lifecycle:
Bagong Produkto:
Bago mula sa manufacturer na ito.
ECAD Model:
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May Stock: 258

Stock:
258
Maaaring Ipadala Agad
Inoorder:
800
Inaasahan 4/16/2026
Lead-Time ng Pabrika:
26
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Minimum: 1   Mga Multiple: 1
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱1,776.54 ₱1,776.54
₱1,501.62 ₱15,016.20
₱1,434.34 ₱35,858.50
₱1,282.38 ₱128,238.00
₱1,223.22 ₱305,805.00
₱1,142.02 ₱456,808.00
1,200 Quote

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Infineon
Kategorya ng Produkto: Mga ARM Microcontroller - MCU
RoHS:  
CYT3DL
SMD/SMT
TEQFP-216
ARM Cortex M0+, ARM Cortex M7
4.06 MB
32 bit
12 bit
100 MHz, 240 MHz
148 I/O
384 kB
1.09 V
1.21 V
- 40 C
+ 105 C
Tray
Voltage ng Analog Supply: 2.7 V to 5.5 V
Brand: Infineon Technologies
Uri ng Data RAM: SRAM
Laki ng Data ROM: 64 kB
Uri ng Data ROM: ROM
Uri ng Interface: CAN FD, Ethernet, I2C, LIN, SPI, UART
Maselan sa Moisture: Yes
Dami ng ADC Channel: 48 Channel
Dami ng Timer/Counter: 50 x 16 bit, 32 x 32 bit
Supply Voltage ng Pagpapatakbo: 2.7 V to 5.5 V
Series ng Processor: TRAVEO T2G
Produkto: MCUs
Uri ng Produkto: ARM Microcontrollers - MCU
Uri ng Memory ng Program: Flash
Dami ng Pack ng Pabrika: 400
Subcategory: Microcontrollers - MCU
Pangalang pangkalakal: TRAVEO
Mga Watchdog Timer: Watchdog Timer
Mga Alias ng # ng Piyesa : CYT3DLABABQ1AESGS SP005862400
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Mga Piniling Attribute: 0

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CAHTS:
8542310000
USHTS:
8542310025
TARIC:
8542319000
ECCN:
5A992.C

TRAVEO™ T2G Cluster

Infineon Technologies TRAVEO™ T2G Cluster MCUs are designed to offer extensive scalability and high performance for automotive applications. These MCUs are fortified with up to two Arm® Cortex®-M7 cores, each clocked at up to 320MHz, delivering a powerful 1500 DMIPS. They also feature impressive memory capacities, with up to 6MB of flash memory and 4MB of VRAM, ensuring ample storage and efficient data handling. Additionally, the TRAVEO™ T2G Cluster comes equipped with a 2.5D graphics engine, enabling advanced graphical displays and enhancing the overall user experience in automotive environments. High processing power, substantial memory, and advanced graphics capabilities make the TRAVEO T2G Cluster a robust solution for modern automotive systems.

CYT3DL TRAVEO™ T2G 32-Bit Automotive MCUs

Infineon Technologies CYT3DL TRAVEO™ T2G 32-Bit Automotive MCUs are dedicated to automotive systems such as instrument clusters and Head-Up Displays (HUD). The CYT3DL  MCUs feature a 2D graphics engine, sound processing, an Arm® Cortex®-M7 CPU running up to 240MHz for primary processing, and an Arm Cortex-M0+ CPU for peripheral/security processing. The MCUs include a WVGA GFX and are available in two unique packages: 216-pin TEQFP and 272-ball BGA. The Infineon TRAVEO T2G CYT3DL family products contain embedded peripherals supporting controller area networks with a flexible data rate (CAN FD), local interconnect networks (LIN), clock extension peripheral interfaces (CXPI), and Ethernet. The devices are manufactured using an advanced 40nm process. The CYT3DL TRAVEO T2G 32-Bit Automotive MCUs incorporate Infineon's low-power flash memory and multiple high-performance analog/digital peripherals and create a secure computing platform.

32-bit TRAVEO™ T2G Arm® Cortex® Microcontrollers

Infineon Technologies 32-bit TRAVEO™ T2G Arm® Cortex® Microcontroller offers cutting-edge performance, safety, and security features for smart green mobility and safety-critical industry applications. These MCUs are built using single Arm® Cortex®-M4F and dual Cortex-M7F and have an enhanced performance of 1500DMIPS in the TRAVEO T2G Arm family. The TRAVEO automotive MCUs offer scalability across memory size and pin count. IP compatibility enables customers to design and develop systems using a single-platform MCU solution. These MCUs possess advanced security features like a Hardware Security Module (HSM), dedicated Cortex-M0+ for secure processing, and embedded flash in dual bank mode for Firmware Over-the-Air (FOTA) requirements.