Die Sensor Interface

Mga Resulta: 95
Pumili Larawan # ng Piyesa
 Mfr.
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Dami RoHS ECAD Model Uri
Uri ng Interface
Supply Voltage - Max
Supply Voltage - Min
Supply Current ng Pagpapatakbo
Minimum na Operating Temperature
Maximum na Operating Temperature
Isitilo ng Mounting
Package / Case
ESD Protection
Packaging
Texas Instruments Sensor Interface DIE SALE
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 200
Mult.: 100

5.5 V 2.7 V 0 C + 70 C SMD/SMT Die
Texas Instruments Sensor Interface DIE SALE
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 30
Mult.: 10

5.5 V 2.7 V 0 C + 70 C SMD/SMT Die
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 10,970
Mult.: 10,970

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 11,922
Mult.: 11,922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 11,922
Mult.: 11,922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 11,922
Mult.: 11,922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface DICE IN WAFFLE PACK
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 1
Mult.: 1

Sensor Signal Conditioner I2C, SPI 3.6 V 1.68 V 1 mA - 40 C + 125 C SMD/SMT Die 4 kV Waffle
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 4,300
Mult.: 4,300

Sensor Signal Conditioner I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 10,970
Mult.: 10,970

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 11,922
Mult.: 11,922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 11,922
Mult.: 11,922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 2,700
Mult.: 2,700

Sensor Signal Conditioner SMD/SMT Die Tray
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 12,000
Mult.: 12,000

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 12,000
Mult.: 12,000

SMD/SMT Die Gel Pack
ScioSense PS081 DICE
ScioSense Sensor Interface Resistance-to-digital converter dice in waffle pack
Datasheet
Lead-Time para sa Hindi Naka-stock 2 (na) Linggo
Min.: 140
Mult.: 140

SMD/SMT Die
Renesas Electronics ZSC31014EAB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 8,500
Mult.: 8,500

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31014EIB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 8,500
Mult.: 8,500

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31050FAB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 2,900
Mult.: 2,900

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31050FEB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 2,900
Mult.: 2,900

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31050FIB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 2,900
Mult.: 2,900

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31150GAB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 2,800
Mult.: 2,800

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31150GAD
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 1
Mult.: 1

SMD/SMT Die Waffle
Renesas Electronics ZSC31150GEB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 2,800
Mult.: 2,800

Sensor Signal Conditioner I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die With ESD Protection Gel Pack
Renesas Electronics ZSC31150GED
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 1
Mult.: 1

SMD/SMT Die Waffle
Renesas Electronics ZSSC3018BA2B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 16,000
Mult.: 16,000

Sensor Signal Conditioner I2C/SPI 3.6 V 1.68 V 1 mA - 40 C + 125 C SMD/SMT Die Gel Pack