Gel Pack Sensor Interface

Mga Resulta: 50
Pumili Larawan # ng Piyesa
 Mfr.
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Dami RoHS ECAD Model Uri
Uri ng Interface
Supply Voltage - Max
Supply Voltage - Min
Supply Current ng Pagpapatakbo
Minimum na Operating Temperature
Maximum na Operating Temperature
Isitilo ng Mounting
Package / Case
ESD Protection
Packaging
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 10,970
Mult.: 10,970

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 11,922
Mult.: 11,922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 11,922
Mult.: 11,922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 11,922
Mult.: 11,922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 4,300
Mult.: 4,300

Sensor Signal Conditioner I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Gel Pack

Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 4,730
Mult.: 4,730

Automotive I2C 5.25 V 4.75 V - 40 C + 150 C SMD/SMT Gel Pack

Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 4,730
Mult.: 4,730

Automotive 1-Wire, I2C, Serial 5.25 V 4.75 V - 40 C + 150 C SMD/SMT QFN-24 Gel Pack

Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 4,730
Mult.: 4,730

Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 10,970
Mult.: 10,970

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 11,922
Mult.: 11,922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 11,922
Mult.: 11,922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 12,000
Mult.: 12,000

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 12,000
Mult.: 12,000

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31014EAB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 8,500
Mult.: 8,500

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31014EIB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 8,500
Mult.: 8,500

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31050FAB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 2,900
Mult.: 2,900

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31050FEB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 2,900
Mult.: 2,900

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31050FIB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 2,900
Mult.: 2,900

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31150GAB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 2,800
Mult.: 2,800

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31150GEB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 2,800
Mult.: 2,800

Sensor Signal Conditioner I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die With ESD Protection Gel Pack
Renesas Electronics ZSSC3018BA2B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 16,000
Mult.: 16,000

Sensor Signal Conditioner I2C/SPI 3.6 V 1.68 V 1 mA - 40 C + 125 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3123AA1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 9,000
Mult.: 9,000

Capacitive Sensor Signal Conditioner with Digital Output I2C, Serial, SPI 5.5 V 2.3 V 100 uA - 40 C + 125 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3123AI1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 9,000
Mult.: 9,000

Capacitive Sensor Signal Conditioner with Digital Output I2C, Serial, SPI 5.5 V 2.3 V 100 uA - 40 C + 125 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3135BA1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 2,800
Mult.: 2,800

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3154BA1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 2,700
Mult.: 2,700

SMD/SMT Die Gel Pack