Die Sensor Interface

Mga Resulta: 91
Pumili Larawan # ng Piyesa
 Mfr.
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Dami RoHS ECAD Model Uri
Uri ng Interface
Supply Voltage - Max
Supply Voltage - Min
Supply Current ng Pagpapatakbo
Minimum na Operating Temperature
Maximum na Operating Temperature
Isitilo ng Mounting
Package / Case
ESD Protection
Packaging
Renesas Electronics ZSSC3215CI1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 12,000
Mult.: 12,000

SMD/SMT Die Tray
Renesas Electronics ZSSC3215CI5B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 12,000
Mult.: 12,000

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3218BI1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 17,000
Mult.: 17,000

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3138BE1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 2,800
Mult.: 2,800

Sensor Signal Conditioner SMD/SMT Die Tray
Renesas Electronics ZSSC3218BI2B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 16,500
Mult.: 16,500

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3224BI2B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 16,500
Mult.: 16,500

Sensor Signal Conditioner I2C, SPI 3.6 V 1.68 V 1 mA - 40 C + 85 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3224BI5B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 15,573
Mult.: 15,573

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3138BA1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 2,800
Mult.: 2,800

Sensor Signal Conditioner SMD/SMT Die Tray
Renesas Electronics ZSSC3230BC6B
Renesas Electronics Sensor Interface WAFER UNSAWN, 725U, WITH INKING
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 21,787
Mult.: 21,787

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3230BI1B
Renesas Electronics Sensor Interface WAFER UNSAWN, 304
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 21,787
Mult.: 21,787

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3230BI2B
Renesas Electronics Sensor Interface ZSSC3230BI2B (WAFER UNSAWN, 725)
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 21,787
Mult.: 21,787

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3230BI5B
Renesas Electronics Sensor Interface ZSSC3230BI5B (WAFER UNSAWN, 304, WITH IN
Datasheet
Lead-Time para sa Hindi Naka-stock 18 (na) Linggo
Min.: 21,787
Mult.: 21,787

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC4151CE1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 4,347
Mult.: 4,347

Sensor Signal Conditioner I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC4151CE1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 1
Mult.: 1

SMD/SMT Die Waffle
Renesas Electronics ZSSC4161DE1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 1
Mult.: 1

Sensor - 40 C + 150 C SMD/SMT Die Waffle
ScioSense PS09 DICE
ScioSense Sensor Interface Resistance-to-digital converter dice in waffle pack
Datasheet
Lead-Time para sa Hindi Naka-stock 26 (na) Linggo
Min.: 575
Mult.: 575

SMD/SMT Die