Mga Data Center Application

Ang mga Bergquist Company Data Center Application ay nagtatampok ng mga advanced material na nakakatulong sa thermal management, long-term reliability, at stress protection. Nadaragdagan ang mga data center speed at volume habang nagiging popular ang analytics, artificial intelligence (AI), at high-performance computing. Dahil sa tumaas na demand na ito, nagiging mas mainit ang mga next-generation data center, at puwedeng makaapekto sa performance ang init na ito. Ang Bergquist Company ay nagdidisenyo at nagma-manufacture ng mga component-level na thermal management at stress protection product, na tumutulong para matugunan ang tumitinding mga performance requirement.

Mga Resulta: 211
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Uri Package / Case Materyal Thermal Conductivity Breakdown Voltage Kulay Minimum na Operating Temperature Maximum na Operating Temperature Haba Lapad Kapal Tensile Strength Rating ng Flammability Series Packaging
Bergquist Company Thermal Interface Products 1-Part, Liquid Formable Material, 4.33 Gallon Pail, 3.5 W/m-K, Liqui-Form Drop Ship ng Pabrika
Min.: 1
Mult.: 1

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 3.5 W/m-K Gray - 60 C + 200 C 330.2 mm 330.2 mm UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 1 Gallon, 6.0 W/m-K, Liqui-Form TLF 6000HG Lead-Time para sa Hindi Naka-stock 12 (na) Linggo
Min.: 1
Mult.: 1
Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG
Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 438
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 1.016 mm 4 psi UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.140" Thickness Lead-Time para sa Hindi Naka-stock 11 (na) Linggo
Min.: 2
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO/Gap Filler 3500LV Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 2
Mult.: 1
Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Silicone Elastomer 3.5 W/m-K Blue, White - 60 C + 200 C UL 94 V-0 3500LV / TGF 3500LVO
Bergquist Company Thermal Interface Products Liquid Gap Filler, 20oz Tube, Gap Filler TGF 3500LVO/3500LV Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Silicone Elastomer 3.5 W/m-K Blue, White - 60 C + 200 C UL 94 V-0 3500LV / TGF 3500LVO
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 180ml Cartridge, 6 W/m-K, Liqui-Form
Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 10
Mult.: 1

Thermal Interface Materials Thermally Conductive Liquid Formable Material TLF 6000HG
Bergquist Company Thermal Interface Products Liquid Gap Filler, 1200CC Kit, Gap Filler TGF 3500LVO/3500LV, IDH 2214048 Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Silicone Elastomer 3.5 W/m-K Blue, White - 60 C + 200 C UL 94 V-0 3500LV / TGF 3500LVO
Bergquist Company Thermal Interface Products Liquid Gap Filler, 1200CC Kit, Gap Filler TGF 3600/3500S35, IDH 2166456 Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Silicone Elastomer 3.6 W/m-K Blue - 60 C + 200 C UL 94 V-0 3500S35 / TGF 3600
Bergquist Company Thermal Interface Products Liquid Gap Filler, 50CC Dual Cartridge, Gap Filler TGF 1500/1500, IDH 2191489 Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 30
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Non-standard Silicone Elastomer 1.8 W/m-K Yellow, White - 60 C + 200 C UL 94 V-0 1500 / TGF 1500
Bergquist Company Thermal Interface Products Conductive, Liquid Gap Filler, 400CC Kit, Gap Filler TGF 1500/1500, IDH 2166694 Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 3
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Non-standard Silicone Elastomer 1.8 W/m-K Yellow, White - 60 C + 200 C UL 94 V-0 1500 / TGF 1500
Bergquist Company Thermal Interface Products Conductive, Liquid Gap Filler, 400CC Kit, Gap Filler TGF 1500/1500, IDH 2167563 Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 3
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Non-standard Silicone Elastomer 1.8 W/m-K Yellow, White - 60 C + 200 C UL 94 V-0 1500 / TGF 1500
Bergquist Company Thermal Interface Products Liquid Gap Filler, 200CC Dual Cartridge, TGF 3500LVO/3500LV, IDH 2196019 Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 9
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Silicone Elastomer 3.5 W/m-K Blue, White - 60 C + 200 C UL 94 V-0 3500LV / TGF 3500LVO
Bergquist Company Thermal Interface Products Liquid Gap Filler, 400CC Kit, Gap Filler TGF 3500LVO/3500LV, IDH 2197935 Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 2
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Silicone Elastomer 3.5 W/m-K Blue, White - 60 C + 200 C UL 94 V-0 3500LV / TGF 3500LVO
Bergquist Company Thermal Interface Products Liquid Gap Filler, 200CC Dual Cartridge, TGF 3600/3500S35, IDH 2190466 Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Silicone Elastomer 3.6 W/m-K Blue - 60 C + 200 C UL 94 V-0 3500S35 / TGF 3600
Bergquist Company Thermal Interface Products Thermally Conductive, Two-Part, Liquid Epoxy Adhesive, 1200cc, Liqui-Bond TLB EA1800 / Bergquist Liqui-Bond EA 1805 Series, IDH 2591002 Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 1
Mult.: 1

Thermally Conductive Adhesives EA 1805 / TLB EA1800
Bergquist Company Thermal Interface Products 1-Part, Liquid Formable Material, 150CC Cartridge, 3.5 W/m-K, Liqui-Form Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 16
Mult.: 1

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 3.5 W/m-K Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products 1-Part, Liquid Formable Material, 300CC Cartridge, 3.5 W/m-K, Liqui-Form Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Thermal Interface Materials Thermally Conductive Liquid Formable Material Silicone Elastomer Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products GAP PAD, 10W/m-K, 8" x 8" Sheet, 0.125" Thickness, TGP10000ULM, IDH 2599713 Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 10 W/m-K 3.2 kVAC Gray - 60 C + 200 C 203.2 mm 203.2 mm 3.175 mm 25 psi UL 94 V-0 TGP 10000ULM
Bergquist Company Thermal Interface Products GAP PAD, 6W/m-K, 8" x 16" Sheet, 0.125" Thickness, TGP6000ULM, IDH 2214846 Lead-Time para sa Hindi Naka-stock 6 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 6 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 3.175 mm 6 psi UL 94 V-0 TGP 6000ULM
Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM, L8INW16INH0.1 Hindi Naka-stock
Min.: 1
Mult.: 1
Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 2.54 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM Hindi Naka-stock
Min.: 5
Mult.: 1
Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Material, 150CC, 3.5 W/m-K, Liqui-Form Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 6
Mult.: 1
Thermal Interface Materials Liquid Form 3.5 W/m-K Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.040" Thickness Lead-Time para sa Hindi Naka-stock 28 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.060" Thickness Lead-Time para sa Hindi Naka-stock 28 (na) Linggo
Min.: 3
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM