Bumalik sa Amphenol

Amphenol FCI DensiStak™ Board-to-Board Connectors

Amphenol FCI DensiStak™ Board-to-Board Connectors are high-density connectors with a dual-beam contact system to ensure reliable performance. The connectors feature an 11-row design with up to 1034 pin positions and an open-pin field design for added flexibility. The DensiStak connectors offer high-speed performance of up to 16Gb/s and meet PCIe® Gen 4, Ethernet, USB, DP, and MIPI protocols. The Amphenol FCI DensiStak Board-to-Board Connectors are constructed with a UL 94V-0-rated housing material that can withstand harsh environments. The connectors are RoHS and USCAR-2 compliant, ideal for automotive applications, including Advanced Driver Assistance Systems (ADAS). The DensiStak devices are also suitable for servers, data storage, artificial intelligence (AI), industrial, and sensing/instrumentation applications.

Features

  • High density up to 1034 positions
  • 11 rows
  • Open-pin field design for added flexibility
  • High speed up to PCIe Gen 4 with 16Gb/s
  • Dual-beam contact system ensures reliable use
  • 0.8mm x 1.25mm compact size
  • Surface-mount soldering tails
  • USCAR-2 compliant for automotive applications
  • UL 94V-0-rated housing withstands harsh environments
  • Halogen- and lead-free, RoHS compliant

Applications

  • Automotive
  • ADAS
  • Servers
  • Data storage
  • AI
  • Industrial
  • Sensing and instrumentation

Specifications

  • Copper alloy terminals and shield
  • 0.2N max contact mating
  • 0.16N max contact unmating
  • 50- to 500-cycle durability per plating option
  • SAE/USCAR-2 V2 mechanical shock/vibration rating
  • 0.8A current rating per contact
  • 4A current rating per shield spring
  • 100mΩ insulation resistance
  • 100VAC/DC voltage rating
  • 40mΩ max contact LLCR
  • 5mΩ max shield LLCR
  • -55°C to +125°C operating temperature range

Additional Resources

Videos

Inilathala: 2024-03-12 | Na-update: 2024-04-09