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The
JAE WP7
Series
features 0.4mm pitch
Board to Board Connectors
with a 0.7mm stacking height that are ideal for high-density mounting in slim information communication devices such as mobile phones, LCDs, notebook PCs, and PDAs. Design features include a contact structure that ensures high wear-resistance and high contact reliability, secure hold-downs to prevent insulator breakage and peeling from
FPC, and 2-point contact design to resist twisting stress.
JAE
offers the
WP7 Series Board to Board Connectors
with a high removal force for lower pin count versions and a lower insertion force for higher pin counts. The low and high pin count versions feature the same mounting pattern to meet different product function requirements.
Features
0.4mm pitch, 2 rows, 0.7mm stacking height
Contact structure ensures high wear-resistance and high contact reliability
Secure hold-downs prevent insulator breakage and peeling from FPC
2-point contact design to resist twisting stress
Pb-free. Ni barrier on contact prevents solder wicking
High removal force for WP7A (low pin count: 10 - 30 positions)
Low insertion force for WP7B (high pin count 40 - 70 positions)
Mounting pattern for WP7A and WP7B is the same
Physical Specifications
Contact: Cu alloy / Au plating (0.1µm min.)
Insulator: Heat-resistant plastic
Hold-Down:
Plug: Cu alloy / Au plating (0.1µm min.)
Receptacle: Cu alloy / Sn plating
General Specifications
No of Contacts:
WP7A: 10, 16, 20, 26, 30
WP7B: 40, 50, 60, 70
Pitch: 0.42mm, 2 rows
Operating Temperature: - 40ºC to +85ºC
Contact Resistance: 70mΩ max. (initial)
Life Time: 50 mating cycles
Rated Current: DC 0.2 A each per terminal
Rated Voltage: AC, DC 50V
Insulation Resistance: 100MΩ max. (initial)
Dielectric Withstanding Voltage: AC250Vr.m.s per minute
(WP7A) Total Insertion Force: 1.50N x n max. (n: No of pos.)
(WP7A) Total Removal Force: 1.50N x n max. (n: No of pos.)
(WP7B) Total Insertion Force: 1.00N x n max. (n: No of pos.)
(WP7B) Total Removal Force: 1.10N x n max. (n: No of pos.)
