Ka-Ro Electronics QFN Style Solder-Down Computer On Modules
Ka-Ro Electronics QFN Style Solder-Down Computer On Modules (COM) are single-sided assembled in a small square size of 27mm and a height of 2.6mm. These modules feature a QFN-type lead style with a 1mm pitch and 100 pads. The QFN-style solder-down modules are industrial-grade and include single-sided assembly and an RGB display interface. The QS91 modules feature an RGB display interface, a 2x USB connectivity, and Arm® Cortex®-A55, 1.4GHz NXP i.MX 91 processor. The QS93 modules feature an LVDS display interface with 2D GPU support and NXP i.MX 93 processor. The QFN-style solder-down modules are ideal for industrial, IoT, and medical applications.
Features
- 27mm square
- 2.6mm total height
- QS family pin-compatible
- Solder-down version
- QFN type lead style:
- 1mm pitch
- 100 pads
- Thermal pad
- Industrial grade
- 4GB eMMC ROM
- Visual solder joint inspection is possible after soldering
- Single-sided assembly
- 3.3V power supply
Applications
- Industrial requirements
- Medical
- IoT
Specifications
- QS91:
- NXP i.MX 91 processor:
- Arm® Cortex®-A55, 1.4GHz
- NXP’s EdgeLock® secure enclave
- RGB display interface
- Connectivity:
- 2x USB 2.0
- Ethernet, RGMII
- 1x eMMC/SD
- 2x FlexCAN
- 8x UART, 7x I²C, 8x SPI, PWM, SAI, and 2x FLEXIO
- ADC (4-channel, 12-bit), tamper detection
- Up to 60x 3.3V general purpose I/O
- NXP i.MX 91 processor:
- QS93:
- NXP i.MX 93:
- Dual Arm® Cortex®-A55, 1.7GHz
- Arm Cortex® -M33, 250MHz
- Arm Ethos® U-65 microNPU
- NXP’s EdgeLock® secure enclave
- Connectivity:
- 2x USB 2.0
- 2x Gb Ethernet, RGMII
- 1x eMMC/SD
- 2x FlexCAN
- 5x UART, 7x I²C, 4x SPI, 6x PWM, and SAI
- Up to 60x 3.3V general purpose I/O
- MIPI-CSI (2-lane)
- NXP i.MX 93:
NXP i.MX 91 Block Diagram
NXP i.MX 93 Block Diagram
Dimension
Inilathala: 2025-02-14
| Na-update: 2025-03-17